Manufacturing Bits: Aug. 20


Making carbon nanotubes with AI Russia’s Skolkovo Institute of Science and Technology (Skoltech) has developed a method to monitor the growth of carbon nanotubes using an artificial intelligence (AI) technology called machine learning. Skoltech used AI to predict the performance of the synthesis of single-walled carbon nanotubes using a chemical vapor deposition (CVD) process. The tec... » read more

Manufacturing Bits: Aug. 13


Exascale supercomputers The Department of Energy’s National Nuclear Security Administration (DOE/NNSA) has signed a contract valued at $600 million with Cray to build NNSA’s first exascale supercomputer. The system, called El Capitan, is expected to be shipped in late 2022. El Capitan will be housed at Lawrence Livermore National Laboratory (LLNL), and will perform research to maintain ... » read more

Manufacturing Bits: Aug. 5


Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

Manufacturing Bits: July 30


Scanning nanopore microscopes ETH Zurich has developed a new microscopy technique that can detect and analyze signals between individual cells in living organisms. The technology, called a force-controlled scanning nanopore microscope, is a new way to look at the behavior of individual cells. So far, researchers have tested the technology on rat brain tissue. It could one day be used to pro... » read more

Manufacturing Bits: July 15


Atomtronics The Institute of Electronic Structure and Laser of the Foundation for Research and Technology-Hellas (IESL-FORTH) and others have developed an atomtronic accelerator ring, a move that could advance the field of atomtronics. Researchers have developed a small accelerator ring-shaped matterwave guide, which is capable of accelerating sub-atomic particles at hypersonic speeds. It c... » read more

Manufacturing Bits: July 10


Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

Manufacturing Bits: July 3


Gamma-ray inspection The Defense Advanced Research Projects Agency (DARPA) has started a program to develop gamma-ray inspection techniques. The effort, called the Gamma Ray Inspection Technology (GRIT) program, is aimed to develop gamma-ray radiation sources in compact form factors for use in national security, industrial, and medical applications. [caption id="attachment_24151285" alig... » read more

Manufacturing Bits: June 25


Panel-level consortium Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several test layouts were designed for process development on ... » read more

Manufacturing Bits: June 18


Making microvias in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that enables ultra-small microvias for advanced IC packages. Researchers demonstrated a picosecond UV laser technology as well as materials, which enabled 2μm to 7μm vias... » read more

Manufacturing Bits: June 10


Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

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