category: Research

category: IoT, Security & Automotive

Manufacturing Bits: Aug. 9
By Mark LaPedus - 09 Aug, 2021 - Comments: 1

Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

Power/Performance Bits: Aug. 9
By Jesse Allen - 09 Aug, 2021 - Comments: 0

Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

Manufacturing Bits: Aug. 3
By Mark LaPedus - 03 Aug, 2021 - Comments: 0

World’s thinnest magnet Lawrence Berkeley National Laboratory, the University of California at Berkeley and others have developed what researchers say is the world’s thinnest magnet. The one-atom-thin, two-dimensional (2D) magnet could one day pave the way towards new spin electronics or spintronics memory devices and other technologies in the market. Spintronics uses the orientation of... » read more

Power/Performance Bits: Aug. 3
By Jesse Allen - 03 Aug, 2021 - Comments: 0

Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

Manufacturing Bits: July 27
By Mark LaPedus - 27 Jul, 2021 - Comments: 0

Merchant quantum processors Startup QuantWare has launched the world’s first merchant and off-the-shelf superconducting processor for quantum computers. QuantWare’s quantum processor unit (QPU), called Soprano, is a 5-qubit device. The QPU can be customized for various applications. The device is ideal for research institutions and university labs. Quantum computing is a hot topic. A... » read more

Power/Performance Bits: July 27
By Jesse Allen - 27 Jul, 2021 - Comments: 0

Amplifying light for lidar Engineers at University of Texas at Austin and University of Virginia developed a light detector that can amplify weak light signals and reduce noise to improve the accuracy of lidar. "Autonomous vehicles send out laser signals that bounce off objects to tell you how far away you are. Not much light comes back, so if your detector is putting out more noise than th... » read more

Manufacturing Bits: July 20
By Mark LaPedus - 20 Jul, 2021 - Comments: 0

Interference EUV lithography ESOL has developed a standalone interference extreme ultraviolet (EUV) lithography tool for use in R&D applications. The system, called EMiLE (EUV Micro-interference Lithography Equipment), is primary used to speed up the development of EUV photoresists and related wafer processes. The system is different than ASML’s EUV lithography scanners, which are ... » read more

Power/Performance Bits: July 20
By Jesse Allen - 20 Jul, 2021 - Comments: 0

Shrinking RFID chips Researchers at North Carolina State University built a new, tiny RFID chip. They expect the chip to help drive down costs for RFID tags, making it possible to embed them in more things for supply chain security. "As far as we can tell, it's the world's smallest Gen2-compatible RFID chip," said Paul Franzon, Professor of Electrical and Computer Engineering at NC State. I... » read more

Manufacturing Bits: July 13
By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Power/Performance Bits: July 13
By Jesse Allen - 13 Jul, 2021 - Comments: 0

Graphene PUFs Researchers at Pennsylvania State University propose using graphene to create physically unclonable functions (PUFs) that are energy efficient, scalable, and secure against AI attacks. The team first fabricated nearly 2,000 identical graphene transistors. Despite their structural similarity, the transistors' electrical conductivity varied due to the inherent randomness arising... » read more

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