category: Research

category: IoT, Security & Automotive

Power/Performance Bits: Feb. 23
By Jesse Allen - 23 Feb, 2021 - Comments: 0

Photonic AI accelerator There are now many processors and accelerators focused on speeding up neural network performance, but researchers at the University of Münster, University of Oxford, Swiss Federal Institute of Technology Lausanne (EPFL), IBM Research Europe, and University of Exeter say AI processing could happen even faster with the use of photonic tensor processors that can handle mu... » read more

Manufacturing Bits: Feb. 16
By Mark LaPedus - 16 Feb, 2021 - Comments: 0

Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for chip-packaging applications. The group, called the Chip-to-Wafer (C2W) Hybrid Bonding Consortium, includes A*STAR’s IME organization, Applied Materials, ASM Pacific, Capcon, HD MicroSystems, ONT... » read more

Power/Performance Bits: Feb. 16
By Jesse Allen - 16 Feb, 2021 - Comments: 0

Superconducting microprocessor Researchers at Yokohama National University created a superconducting processor with zero electrical resistance. Huge amounts of power are being used by computers today, and compared to the human brain, they are many orders of magnitude less efficient. Superconductors have been a popular approach to making computers more efficient, but this requires extreme co... » read more

Manufacturing Bits: Feb. 8
By Mark LaPedus - 08 Feb, 2021 - Comments: 0

Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

Power/Performance Bits: Feb. 8
By Jesse Allen - 08 Feb, 2021 - Comments: 0

Transparent sensor Researchers at Osaka University created a thin, flexible, transparent sensor using silver nanowire networks. High-resolution printing was used to fabricate the centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals... » read more

Manufacturing Bits: Feb. 2
By Mark LaPedus - 02 Feb, 2021 - Comments: 0

Capacitor-less DRAM At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. DRAM itself is based on a one-transistor, one-capacito... » read more

Power/Performance Bits: Feb. 2
By Jesse Allen - 02 Feb, 2021 - Comments: 0

MXene antennas Researchers at Drexel University and Villanova University developed spray-on antennas made of the 2D materials MXene that is flexible and light while maintaining good signal. "This combination of communications performance with extreme thinness, flexibility and durability sets a new standard for antenna technology," said Yury Gogotsi, professor of Materials Science and Engine... » read more

Manufacturing Bits: Jan. 26
By Mark LaPedus - 26 Jan, 2021 - Comments: 1

EU FIB project The European Union (EU) has launched a new project to develop next-generation structures and materials using focused ion beam (FIB) systems. The EU project, dubbed Focused Ion Technology for Nanomaterials or FIT4NANO, is spearheaded by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) organization. The project aims to bring European researchers and companies together to develop... » read more

Power/Performance Bits: Jan. 26
By Jesse Allen - 26 Jan, 2021 - Comments: 0

Neural networks on MCUs Researchers at MIT are working to bring neural networks to Internet of Things devices. The team's MCUNet is a system that designs compact neural networks for deep learning on microcontrollers with limited memory and processing power. MCUNet is made up of two components. One is TinyEngine, an inference engine that directs resource management. TinyEngine is optimized t... » read more

Manufacturing Bits: Jan. 19
By Mark LaPedus - 19 Jan, 2021 - Comments: 0

X-ray imaging with AI The U.S. Department of Energy’s Argonne National Laboratory has demonstrated the use of artificial intelligence (AI) to accelerate the process of reconstructing images from coherent X-ray scattering data. Argonne’s technology, called PtychoNN, combines an X-ray imaging technique called ptychography with a neural network. This in turn enables researchers to decode X... » read more

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