category: Research: LPHP

category: IoT, Security & Automotive

Research Bits: Dec. 11
By Jesse Allen - 11 Dec, 2024 - Comments: 0

Photonic AI processor Researchers from Massachusetts Institute of Technology (MIT), Enosemi, and Periplous developed a fully integrated photonic processor that can perform all the key computations of a deep neural network optically on the chip. The chip is fabricated using commercial foundry processes and uses three layers of devices that perform linear and nonlinear operations. A particula... » read more

Research Bits: Dec. 3
By Jesse Allen - 03 Dec, 2024 - Comments: 0

Self-assembly of mixed-metal oxide arrays Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors with high yield and could be used for more complex electronic devices. “Our self-assembling approach is significantly faster and less expensi... » read more

Chip Industry Technical Paper Roundup: Dec. 3
By Linda Christensen - 03 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=391 /] » read more

Chip Industry Technical Paper Roundup: Nov. 25
By Linda Christensen - 25 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Research Bits: Nov. 25
By Jesse Allen - 25 Nov, 2024 - Comments: 0

3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Research Bits: Nov. 19
By Jesse Allen - 19 Nov, 2024 - Comments: 0

Starchy nanocomposite films Researchers from Queen Mary University of London created biodegradable, flexible, and electrically conductive nanocomposite films made using potato starch instead of petroleum-based materials. The starch-based films decompose within a month when buried in soil. In addition to starch, the nanocomposite films contain the conductive 2D material MXene. Adjusting the ... » read more

Research Bits: Nov. 11
By Jesse Allen - 11 Nov, 2024 - Comments: 0

Quantum tunneling transistor Researchers from MIT and University of Udine fabricated a transistor that uses ultrathin layers of gallium antimonide and indium arsenide arranged in vertical nanowire heterostructures with a diameter of 6nm. The quantum tunneling effects of the material enable it to simultaneously achieve low-voltage operation and high performance. “This is a technology with ... » read more

Chip Industry Technical Paper Roundup: Nov. 11
By Linda Christensen - 11 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=381 /] More Reading Technical Paper Library » read more

Chip Industry Technical Paper Roundup: Nov. 5
By Linda Christensen - 05 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Research Bits: Nov. 5
By Jesse Allen - 05 Nov, 2024 - Comments: 0

Optical in-memory computing Researchers from the University of Pittsburgh, University of California Santa Barbara, University of Cagliari, and Institute of Science Tokyo propose a resonance-based photonic architecture which leverages the non-reciprocal phase shift in magneto-optical materials to implement photonic in-memory computing. “The materials we use in developing these cells have b... » read more

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