Chip Industry Technical Paper Roundup: May 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=434 /] Find more semiconductor research papers here. » read more

Research Bits: May 27


Tracking ferroelectric domain walls Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning oscillator piezoresponse force microscopy to observe how domain walls move in ferroelectric materials under rapidly fluctuating electric fields. “Domain walls can have completely different properties from the neighboring domains they s... » read more

Chip Industry Technical Paper Roundup: May 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

Research Bits: May 20


Smart t-shirt with sound waves Researchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily avai... » read more

Chip Industry Technical Paper Roundup: May 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=430 /] Find more semiconductor research papers here.   » read more

Research Bits: May 13


Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Chip Industry Technical Paper Roundup: May 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=427 /] Find more semiconductor research papers here.   » read more

Research Bits: May 6


Destroying hydrogen peroxide and triazole Researchers from the University of Technology Sydney and startup Infinite Water International developed catalytic technology that breaks down hydrogen peroxide and triazole, two chemicals used in semiconductor manufacturing for surface cleaning and corrosion prevention. The goal is to create a cleaner wastewater stream that can be reused within the fab... » read more

Chip Industry Technical Paper Roundup: Apr. 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Research Bits: Apr. 29


Microchannels for two-phase cooling Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better managem... » read more

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