category: Research: MDT

category: IoT, Security & Automotive

Manufacturing Bits: Oct. 29
By Mark LaPedus - 29 Oct, 2019 - Comments: 1

Searching for dark energy The first tests have been conducted on a new cosmic cartography system that will soon search for dark energy and galaxies in the universe. The system, called the Dark Energy Spectroscopic Instrument (DESI), is a complex unit with 5,000 fiber-optic eyes. The DESI system is mounted on top of the 4-meter Mayall Telescope at the Kitt Peak National Observatory in Ariz... » read more

Manufacturing Bits: Oct. 22
By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Manufacturing Bits: Oct. 15
By Mark LaPedus - 15 Oct, 2019 - Comments: 0

Sandia’s fab upgrade Sandia National Laboratories has completed the first phase of a three-year upgrade program in its semiconductor wafer fab. The goal of the program is to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is ... » read more

Manufacturing Bits: Oct. 9
By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Manufacturing Bits: Oct. 1
By Mark LaPedus - 01 Oct, 2019 - Comments: 0

3D balloon printing Using an elastomeric or stretchy balloon, the University of Houston and the University of Colorado have developed a new 3D printing method as a means to develop three-dimensional curvy electronic products. The technology involves the field of 3D printing, sometimes known as additive manufacturing (AM). In 3D printing, the goal is to develop parts layer-by-layer using mat... » read more

Manufacturing Bits: Sept. 24
By Mark LaPedus - 24 Sep, 2019 - Comments: 0

Free flow electricity Researchers have made some new breakthroughs in the emerging field of Weyl fermions and semi-metals, a move that could one day enable free flow electricity in systems. In 2015, Princeton University and others finally proved a massless particle that had been theorized for 85 years--the Weyl fermion. A fermion is a subatomic particle. Proposed by the mathematician and... » read more

Manufacturing Bits: Sept. 17
By Mark LaPedus - 17 Sep, 2019 - Comments: 0

Full-chip inverse lithography D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). For years, ILT has been a promising technology. ILT is a next-generation reticle enhancement technique (RET) that enables an optimal photomask pattern for both optical and extreme ultraviolet (EUV) lithography reticles.... » read more

Manufacturing Bits: Sept. 11
By Mark LaPedus - 11 Sep, 2019 - Comments: 0

Periodic table for molecules In what could propel the development of new materials, the Tokyo Institute of Technology has developed a periodic table for molecules. If the proposed concept is developed and adopted, the table could one day be used for creating new materials. It also may predict new materials for future use. This table is somewhat akin to the periodic table of elements, wh... » read more

Manufacturing Bits: Sept. 3
By Mark LaPedus - 03 Sep, 2019 - Comments: 1

Modeling SiC defects The Institute of Nuclear Physics of the Polish Academy of Sciences (IFJ PAN) has developed a model that reveals the nature of crystal defects in silicon carbide (SiC). Defectivity is an issue for SiC, a compound semiconductor material based on silicon and carbon. Today, SiC is used to make specialized power semiconductors for high-voltage applications, such as electric ... » read more

Manufacturing Bits: Aug. 27
By Mark LaPedus - 27 Aug, 2019 - Comments: 0

Holographic lithography Switzerland’s Nanotech SWHL GmbH has come out of stealth mode and disclosed its initial technology—a holographic lithography system. Founded in 2015, Nanotech SWHL has developed a sub-wavelength holographic lithography system that generates and prints 3D images on surfaces with one mask at one exposure. Still in R&D, the system is initially targeted for advanced ... » read more

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