New Approaches For Hardware Security

By Ed Sperling - 01 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. (L-R) Norman Chang, Helena Handschuh, Mike Borza. Pho... » read more

Tackling Safety And Security

By Brian Bailey - 10 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss industry attitudes towards safety and security with Dave Kelf, chief marketing officer for Breker Verification; Jacob Wiltgen, solutions architect for functional safety at Mentor, a Siemens Business; David Landoll, solutions architect for OneSpin Solutions; Dennis Ciplickas, vice president of characterization solutions at PDF Solutions; Andrew Dauma... » read more

How To Automate Functional Safety

By Ann Mutschler - 02 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss functional safety thinking, techniques and approaches to automation with Mike Stellfox, Fellow at Cadence; Bryan Ramirez, strategic marketing manager at Mentor, a Siemens Business; Jörg Grosse, product manager for functional safety at OneSpin Solutions; and Marc Serughetti, senior director of product marketing for automotive verification solutions ... » read more

Who’s Responsible For Security Breaches?

By Brian Bailey - 24 Jun, 2019 - Comments: 0

Disregard Safety And Security At Your Own Peril

By Brian Bailey - 10 Jun, 2019 - Comments: 0

Building Security Into RISC-V Systems

By Ed Sperling - 30 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Helena Handschuh, a Rambus fellow; Richard Newell, senior principal product architect at Microsemi, a Microchip Company; and Joseph Kiniry, principal scientist at Galois. Part one is here. (This is the second of two parts.) L-R: Joseph Kiniry, Helena Handschuh, Richard Newell. SE: Some of the new applications for hardware designs are tied to AI, d... » read more

IoT Device Security Makes Slow Progress

By Ann Mutschler - 10 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chris Jones, vice president of marketing at Codasip; Martin Croome, vice president of business development at GreenWaves Technologies; Kevin McDermott, vice president of marketing at Imperas; Scot Morrison, general manager, embedded platform technology at Mentor, a Siemens Business; Lauri Koskinen, CTO at Minima; and Mike Borza, principal security technol... » read more

Open-Source RISC-V Hardware And Security

By Ed Sperling - 12 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Helena Handschuh, a Rambus fellow; Richard Newell, senior principal product architect at Microsemi, a Microchip Company; and Joseph Kiniry, principal scientist at Galois. What follows are excerpts of that conversation. (L-R) Joseph Kiniry, Helena Handschuh and Richard Newell. SE: Is open-source hardware more secure, or does it just open up vulnera... » read more

The Rising Cost Of 5G

By Ed Sperling - 22 Aug, 2018 - Comments: 0

Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

Pros, Cons Of ML-Specific Chips

By Ed Sperling - 27 Jul, 2018 - Comments: 1

Semiconductor Engineering sat down with Rob Aitken, an Arm fellow; Raik Brinkmann, CEO of OneSpin Solutions; Patrick Soheili, vice president of business and corporate development at eSilicon; and Chris Rowen, CEO of Babblelabs. What follows are excerpts of that conversation. To view part one, click here. Part two is here. SE: Is the industry's knowledge of machine learning keeping up with th... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Round Tables

category: IoT, Security & Automotive