Are Digital Twins Something For EDA To Pursue?

By Ann Mutschler - 07 Aug, 2019 - Comments: 0

‘Digital Twins’ are one of the new, fashionable key concepts for system developers, but do they fit with EDA? How many different types of engines do these twins run on – abstract simulation, signal-based RTL simulation, emulation, prototyping, actual silicon? What should the use models be called for digital twinning – like reproduction of bugs from silicon in emulation? Or optimizing th... » read more

Partitioning Drives Architectural Considerations

By Ann Mutschler - 19 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss partitioning with Raymond Nijssen, vice president of system engineering at Achronix; Andy Ladd, CEO at Baum; Dave Kelf, chief marketing officer at Breker; Rod Metcalfe, product management group director in the Digital & Signoff Group at Cadence; Mark Olen, product marketing group manager at Mentor, a Siemens Business; Tom Anderson, technical mar... » read more

Breaking Down The Debug Process

By Brian Bailey - 17 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. What fol... » read more

Evolution Of Verification Engineers

By Brian Bailey - 22 May, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, chief executive officer for VTool; Adnan Hamid, chief executive office for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions archit... » read more

Incremental System Verification

By Brian Bailey - 16 May, 2019 - Comments: 0

When Verification Leads

By Brian Bailey - 25 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, CEO for VTool; Adnan Hamid, CEO for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions architect for Cadence Design Systems; and Tom... » read more

The Role Of EDA In AI

By Brian Bailey - 17 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

From AI Algorithm To Implementation

By Brian Bailey - 10 Apr, 2019 - Comments: 0

The Automation Of AI

By Brian Bailey - 28 Mar, 2019 - Comments: 0

Data-Driven Verification Begins

By Ed Sperling - 27 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss data-driven verification with Yoshi Watanabe, senior software architect at Cadence; Hanan Moller, systems architect at UltraSoC; Mark Conklin, principal verification engineer at Arm; and Hao Chen, senior design engineer at Intel. What follows are excerpts of that conversation, which was conducted in front of a live audience at DVCon. (L-R) Yosh... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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