Problems Ahead for EDA

By Brian Bailey - 19 May, 2015 - Comments: 0

Semiconductor Engineering sat down with [getperson id="11411" comment="Bill Neifert"], chief technology officer at [getentity id="22521" comment="Carbon Design Systems"]; [getperson id="11032" comment="Simon Davidmann”], chief executive officer for [getentity id="22036" e_name="Imperas”]; Randy Smith, vice president of marketing for [getentity id="22605" e_name="Sonics"] and Michel Courtoy,... » read more

Power Management Verification Requires Holistic Approach

By Ann Mutschler - 14 May, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss power management [getkc id="10" kc_name="Verification"] issues with Arvind Shanmugavel, senior director, applications engineering at [getentity id="22021" e_name="Ansys-Apache"]; Guillaume Boillet, technical marketing manager at [getentity id="22026" e_name="Atrenta"]; Adam Sherer, verification product management director at [getentity id="22032" e_... » read more

FD-SOI Vs. FinFETs

By Ed Sperling - 13 May, 2015 - Comments: 3

Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

IP Market Shifts Direction

By Ed Sperling - 07 May, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss intellectual property changes and challenges with Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and MSIP at [getentity id="22035" e_name="Synopsys"]; Kurt Shuler, vice president of marketing at [getentity i... » read more

Problems Ahead For EDA

By Brian Bailey - 06 May, 2015 - Comments: 2

FD-SOI Vs. FinFETs

By Ed Sperling - 30 Apr, 2015 - Comments: 0

Problems Ahead For EDA

By Brian Bailey - 27 Apr, 2015 - Comments: 0

You may have discovered that the Semiconductor Engineering Knowledge Center (KC) provides various ways in which data can be viewed. One way is to see what events happened in a given year. During the 1990s, company activity in terms of new startups and acquisitions reached a peak, and in 1997 there were at least 29 startups that the KC contains and 25 companies acquired (let us know if there wer... » read more

FD-SOI Vs. FinFETs

By Ed Sperling - 16 Apr, 2015 - Comments: 1

Ecosystem Changes

By Ed Sperling - 15 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the semiconductor ecosystem with Kelvin Low, senior director of foundry marketing at [getentity id="22865" e_name="Samsung Semiconductor"]; John Costello, vice president of product planning at [getentity id="22849" e_name="Altera"]; Randy Smith, vice president of marketing at [getentity id="22605" e_name="Sonics"], and Michiel Ligthart, p... » read more

Ecosystem Changes

By Ed Sperling - 07 Apr, 2015 - Comments: 0

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Round Tables

category: IoT, Security & Automotive

Problems Ahead for EDA

Power Management Verification Requires Holistic Approach

FD-SOI Vs. FinFETs

IP Market Shifts Direction

Problems Ahead For EDA

FD-SOI Vs. FinFETs

Problems Ahead For EDA

FD-SOI Vs. FinFETs

Ecosystem Changes

Ecosystem Changes