V2X Security Is Multi-faceted, And Not All There


Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and potential security issues, with Shawn Carpenter, program director, 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Photonics: The Former And Future Solution


Experts at the Table: Semiconductor Engineering sat down to talk about where photonics is in the hype cycle and its secure role in data centers, with James Pond, fellow at Ansys; Gilles Lamant, distinguished engineer at Cadence; and Mitch Heins, business development manager for photonic solutions at Synopsys. What follows are excerpts of that conversation. [L-R]: Ansys’ Pond, Cadence�... » read more

Security Is Critical For Commercial Chiplets


Experts at the Table: Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA prod... » read more

V2X Path To Deployment Still Murky


Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment, with Shawn Carpenter, program director for 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Chiplet IP Standards Are Just The Beginning


Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

Commercial Chiplet Ecosystem May Be A Decade Away


Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product mana... » read more

Rapid Changes Add New Concerns For IC Industry


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Broad Impact From Accelerating Tech Cycles


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Memory’s Future Hinges On Reliability


Experts at the Table: Semiconductor Engineering sat down to talk about the impact of power and heat on off-chip memory, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Inspection, Metrology Issues In Advanced Packages


Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at O... » read more

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