Security Improving For Low-Cost Hardware

By Adam Kovac - 05 Sep, 2024 - Comments: 0

Security has been a priority in software for decades, but only recently has it begun catching up in chips — particularly those in inexpensive devices. The disconnect is that while these devices are low-cost, they often are connected to the same networks as more sophisticated devices and repositories for valuable data. It's not unusual for the entry point in ransomware or distributed denial... » read more

12 Levers to Elevate Your Software Testing

By Synopsys - 05 Sep, 2024 - Comments: 0

Software dominates automotive functions. Superior product and software quality are the key to high customer satisfaction, meeting safety requirements, and conquering tough timelines. The challenge is how to achieve maximum software quality without hiring an army of testers. This checklist describes 12 levers you can pull to help you build the most effective test team, while making your tes... » read more

DDR5 Client Chipset

By Rambus - 05 Sep, 2024 - Comments: 0

This episode of Ask the Experts discusses DDR5 for client systems with John Eble, VP of Product Marketing, Memory Interface Chips at Rambus. Topics discussed include: The need for advanced chipsets for DDR5 client DIMMs The role of the DDR5 Client Clock Driver (CKD) and its use cases The AI applications driving the need for greater memory performance in client systems Find more... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 1

By Diana Car - 05 Sep, 2024 - Comments: 0

The process of electrification of railways, though crucial for achieving net-zero climate targets, is nevertheless far from being complete. Let's delve into how high-power semiconductor technologies are accelerating the decarbonization of rail transport, making it cleaner, safer, and smarter. Decarbonization of transportation: Unraveling the global picture According to the International Ene... » read more

Exploring Machine Learning Enabled Microcontrollers As An Alternative To Linux-Based MPUs

By Infineon - 05 Sep, 2024 - Comments: 0

In today’s rapidly evolving technology landscape, the distinction between microcontrollers (MCUs) and micro processors (MPUs) is blurring with the introduction of high-performance Arm Cortex M processors. A compelling proposition emerges when a highly integrated device, PSOC™ Edge MCU, combines the power of the Cortex®M55 with advanced graphic peripherals, DSP Helium, and a neural net... » read more

Bird’s Eye View on Tensilica Vision DSPs

By Cadence - 05 Sep, 2024 - Comments: 0

The increasing use of cameras in automotive advanced driver assistance systems (ADAS) has resulted in a greater demand for the capability and performance of vision applications. This demand requires sophisticated vision processing algorithms and powerful digital signal processors (DSPs) to run them. Because of the limited power and cost budgets of these embedded systems, it is important t... » read more

Why Connectivity Is Changing Microcontrollers

By Ed Sperling - 22 Aug, 2024 - Comments: 0

More devices are being connected to the internet and to each other, transforming what used to be a simple microprocessor with fixed memory and limited connectivity into a much more complex and versatile device. These new MCUs need more compute power, more memory both on and off-chip, and on-the-fly encryption/decryption. Sivaram Trikutam, vice president of the Wi-Fi product line at Infineon, ta... » read more

Hardware Security Set To Grow Quickly

By Adam Kovac - 22 Aug, 2024 - Comments: 0

Experts At The Table: The hardware security ecosystem is young and relatively small but could see a major boom in the coming years. As companies begin to acknowledge how vulnerable their hardware is, industry standards are being set, but must leave room for engineers to experiment. As part of an effort to determine the best way forward, Semiconductor Engineering sat down with a panel of experts... » read more

Ensure Reliability In Automotive ICs By Reducing Thermal Effects

By Lee Wang - 05 Aug, 2024 - Comments: 0

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D assembly offers numerous benefits, including enhanced performance, reduced power consumption, and more efficient use of space. However, this advanced technology also introduces significant thermal di... » read more

A Practical Approach To Inline Memory Encryption And Confidential Computing For Enhanced Data Security

By Ajay Kapoor - 01 Aug, 2024 - Comments: 0

In today's technology-driven landscape in which reducing TCO is top of mind, robust data protection is not merely an option but a necessity. As data, both personal and business-specific, is continuously exchanged, stored, and moved across various platforms and devices, the demand for a secure means of data aggregation and trust enhancement is escalating. Traditional data protection strategies o... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: IoT and Security

category: IoT, Security & Automotive