Intel Vs. Samsung Vs. TSMC


The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

When To Expect Domain-Specific AI Chips


The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is moving in the opposite direction, creating a gap that could force significant changes in how chips and systems are architected in the future. Behind this split is the amount of time it takes to design hardware and software. In the 18 months since ChatGPT was launched on the world, there has ... » read more

3D Metrology Meets Its Match In 3D Chips And Packages


The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

The Race To Glass Substrates


The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Glass has been discussed as a replacement material for silicon and organic substrates for more than a decade, primarily in multi-die packages. But ... » read more

Chip Aging Becoming Key Factor In Data Center Economics


Chip aging is becoming a much bigger concern inside of data centers, where it can impact server uptime, utilization rates, and the amount of energy needed to drive signals and cool entire server racks. Aging in chips is the result of both higher logic utilization and increasing transistor density. This is problematic for data centers, in general, but especially for AI chips where digital log... » read more

Securing The World’s Data: A Looming Challenge


A combination of increasingly complex designs, more connected devices, and a mix of different generations of security technology are creating a whole new set of concerns about the safety of data nearly everywhere. While security experts have been warning of a growing threat in electronics for decades, there have been several recent fundamental changes that elevate the risk. Among them: ... » read more

EDA Looks Beyond Chips


Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

Architecting Chips For High-Performance Computing


The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

Digital Twins Target IC Tool And Fab Efficiency


Digital twins have emerged as the hot "new" semiconductor manufacturing technology, enabling fabs to create a virtual representation of a physical system on which to experiment and optimize what's going on inside the real fab. While digital twin technology has been in use for some time in other industries, its use has been limited in semiconductor manufacturing. What's changing is the breadt... » read more

Silicon Photonics Manufacturing Ramps Up


Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and stored. The laws of physics are immutable. Put simply, there are limits to how fast an electron can travel through copper. The... » read more

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