category: Special Reports

category: IoT, Security & Automotive

Blockchain: Hype, Reality, Opportunities
By Susan Breidenbach - 04 Jan, 2018 - Comments: 4

Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

The Trouble With Models
By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

EDA Challenges Machine Learning
By Brian Bailey - 14 Dec, 2017 - Comments: 1

Over the past few years, [getkc id="305" kc_name="machine learning"] (ML) has evolved from an interesting new approach that allows computers to beat champions at chess and Go, into one that is touted as a panacea for almost everything. While there is clearly a lot of hype surrounding this, it appears that machine learning can produce a better outcome for many tasks in the EDA flow than even the... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

What’s Next For Atomic Layer Etch?
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

China’s Ambitious Automotive Plans
By Ed Sperling - 08 Nov, 2017 - Comments: 1

China has big plans for cars—and other related markets. After years of trailing behind Japanese, European and U.S.-based carmakers in automotive technology, reliability, status, and even market share within its own political borders, the country is making a concerted push into internally developed and manufactured assisted- and self-driving vehicles. The strategy plays out well for China o... » read more

Radar Versus LiDAR
By Mark LaPedus - 23 Oct, 2017 - Comments: 6

Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

Trimming Waste In Chips
By Brian Bailey - 12 Oct, 2017 - Comments: 0

Extra circuitry costs money, reduces performance and increases power consumption. But how much can really be trimmed? When people are asked that question they either get defensive or they see it as an opportunity to show the advantages of their architecture, design process or IP. The same holds true for IP suppliers. Others point out that the whole concept of waste is somewhat strange, becau... » read more

Starting Point Is Changing For Designs
By Ed Sperling - 04 Oct, 2017 - Comments: 0

The starting point for semiconductor designs is shifting. What used to be a fairly straightforward exercise of choosing a processor based on power or performance, followed by how much on-chip versus off-chip memory is required, has become much more complicated. This is partly due to an emphasis on application-specific hardware and software solutions for markets that either never existed befo... » read more

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