category: Architectures

category: IoT, Security & Automotive

Review of Advances in 3D integration of 2D Neuromorphic Electronics, Materials to Systems
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A new technical paper titled "2D materials-based 3D integration for neuromorphic hardware" was published by researchers at  Seoul National University and University of Southern California. Find the technical paper here. November 2024. Kim, S.J., Lee, HJ., Lee, CH. et al. 2D materials-based 3D integration for neuromorphic hardware. npj 2D Mater Appl 8, 70 (2024). https://doi.org/10.10... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

New Approach to Encoding Optical Weights for In-Memory Photonic Computing Using Magneto-Optic Memory Cells
By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A new technical paper titled "Integrated non-reciprocal magneto-optics with ultra-high endurance for photonic in-memory computing" was published by researchers at UC Santa Barbara, University of Cagliari, University of Pittsburgh, AIST and Tokyo Institute of Technology. Abstract "Processing information in the optical domain promises advantages in both speed and energy efficiency over existi... » read more

Formally Modeling and Verifying CXL Cache Coherence (Imperial College London)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Formalising CXL Cache Coherence" was published by researchers at Imperial College London. Abstract "We report our experience formally modelling and verifying CXL.cache, the inter-device cache coherence protocol of the Compute Express Link standard. We have used the Isabelle proof assistant to create a formal model for CXL.cache based on the prose English spec... » read more

Open-Source, Chiplet-Compatible RISC-V Controller
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "ControlPULPlet: A Flexible Real-time Multi-core RISC-V Controller for 2.5D Systems-in-package" was published by researchers at ETH Zurich and University of Bologna. Abstract "The increasing complexity of real-time control algorithms and the trend toward 2.5D technology necessitate the development of scalable controllers for managing the complex, integrated oper... » read more

Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs" was published by researchers at Cornell University. "In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated th... » read more

3D Device With BEOL-Compatible Channel And Physical Design for Efficient Double-Side Routing
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Omni 3D: BEOL-Compatible 3D Logic with Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation, and Carnegie Mellon University. Abstract "This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves ... » read more

GPUs: Bandit Based Framework To Dynamically Reduce Energy Consumption
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Online Energy Optimization in GPUs: A Multi-Armed Bandit Approach" was published by researchers at Illinois Institute of Technology, Argonne National Lab and Emory University. Abstract "Energy consumption has become a critical design metric and a limiting factor in the development of future computing architectures, from small wearable devices to large-scale lea... » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets
By Technical Paper Link - 16 Oct, 2024 - Comments: 0

A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ., Samsung)
By Technical Paper Link - 11 Oct, 2024 - Comments: 0

A new technical paper titled "Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM" was published by researchers at Sungkyunkwan University and Samsung Electronics. Abstract: "The challenges associated with semiconductor are increasing because of the rapid changes in the semiconductor market and the extreme scaling of semiconductors, with some processes reaching their te... » read more

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