Machine Intelligence on Wireless Edge Networks with RF Analog Architecture (MIT, Duke)


A new technical paper titled "Machine Intelligence on Wireless Edge Networks" was published by researchers at MIT and Duke University. Abstract "Deep neural network (DNN) inference on power-constrained edge devices is bottlenecked by costly weight storage and data movement. We introduce MIWEN, a radio-frequency (RF) analog architecture that "disaggregates" memory by streaming weights wirele... » read more

Review Paper: Wafer-Scale Accelerators Versus GPUs (UC Riverside)


A new technical paper titled "Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs" was published by researchers at UC Riverside. "This review compares wafer-scale AI accelerators and single-chip GPUs, examining performance, energy efficiency, and cost in high-performance AI applications. It highlights enabling technologies like TSMC’s chip-on-wafe... » read more

Towards Base-Station-On-Chip: Wireless Communication Kernels On A RISC-V Vector Processor (TU Dresden, CeTI)


A new technical paper titled "Towards a Base-Station-on-Chip: RISC-V Hardware Acceleration for wireless communication" was published by researchers at TU Dresden and Centre for Tactile Internet with Human-in-the-Loop (CeTI). Abstract "The evolution of 5G and the emergence of 6G wireless communication systems impose higher demands for computing capabilities and lower power consumption in the... » read more

Evaluation of LLMs on HDL-Based Communication Protocol Generation (U. of Illinois Urbana, CISPA)


A new technical paper titled "ProtocolLLM: RTL Benchmark for SystemVerilog Generation of Communication Protocols" was published by researchers at University of Illinois Urbana Champaign and CISPA Helmholtz Center for Information Security. Abstract "Recent advances in Large Language Models (LLMs) have shown promising capabilities in generating code for general-purpose programming languages. ... » read more

Chiplet-to-Chiplet Gateway Architecture, A C2C Interface Bridging Two Chiplet Protocols (Peter Grünberg, Jülich Supercomputing Centre)


A new technical paper titled "Modeling Chiplet-to-Chiplet (C2C) Communication for Chiplet-based Co-Design" was published by researchers at Peter Grünberg Institute and Jülich Supercomputing Centre. Abstract "Chiplet-based processor design, which combines small dies called chiplets to form a larger chip, enables scalable designs at economical costs. This trend has received high attention s... » read more

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)


A new technical paper titled "MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules" was published by researchers at Georgia Tech. Abstract "Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by par... » read more

Automotive Security Risks Associated With Wireless Communication


A new technical paper titled "Revisiting Wireless Cyberattacks on Vehicles" was published by researchers at Comillas Pontifical University and MIT. Abstract "The automotive industry has been a prime target for cybercriminals for decades, with attacks becoming more sophisticated as vehicles integrate advanced digital technologies. In response, new standards and regulations have been introduc... » read more

Controlled Shared Memory For Dynamically Controlling Data Communication Via Shared Memory Approaches (ASU, Intel)


A new technical paper titled "Controlled Shared Memory (COSM) Isolation: Design and Testbed Evaluation" was published by researchers at Arizona State University and Intel Corporation. Abstract "Recent memory sharing approaches, e.g., based on the Compute Express Link (CXL) standard, allow the flexible high-speed sharing of data (i.e., data communication) among multiple hosts. In information... » read more

3D Photonic Integration For Ultra-Low-Energy, High-Bandwidth Interchip Data Links (Columbia et al.)


A new technical paper titled "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links" was published by researchers at Columbia University, Cornell University, Air Force Research Laboratory Information Directorate and Dartmouth College. Abstract "Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by ... » read more

Review Of Recent Advancements in THz-based 6G: Devices, Circuits, Antennas and Packaging


A new technical paper titled "A Survey on Advancements in THz Technology for 6G: Systems, Circuits, Antennas, and Experiments" was published by UCLA. Abstract "Terahertz (THz) carrier frequencies (100 GHz to 10 THz) have been touted as a source for unprecedented wireless connectivity and high-precision sensing, courtesy of their wide bandwidth availability and small wavelengths. However, no... » read more

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