category: Communication/Data Movement

category: IoT, Security & Automotive

Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically" was published by researchers at University of Cambridge and GlitterinTech Limited. Abstract "Silicon photonic switches are widely considered as a cost-effective solution for addressing the ever-growing data traffic in datacenter networks, as they offer unique advantages such as low power co... » read more

CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "The Hitchhiker’s Guide to Programming and Optimizing CXL-Based Heterogeneous Systems" was published by researchers at UC San Diego, Samsung, SK hynix. Abstract "We present a thorough analysis of the use of CXL-based heterogeneous systems. We built a cluster of server systems that combines different vendor's CPUs and various types of CXL devices. We further ... » read more

Visualization of Photoexcited Charges Moving Across the Interface of Si/Ge
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A technical paper titled "Imaging hot photocarrier transfer across a semiconductor heterojunction with ultrafast electron microscopy" was published by researchers at UC Santa Barbara and UCLA. "In this work, we apply scanning ultrafast electron microscopy to provide a holistic view of photoexcited charge dynamics in a Si/Ge heterojunction. We find that the built-in potential and the band off... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies
By Technical Paper Link - 25 Sep, 2024 - Comments: 0

A new technical paper titled "Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz" was published by researchers at NIST. Abstract "We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave ele... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)
By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

DL Compiler for Efficiently Utilizing Inter-Core Connected AI Chips (UIUC, Microsoft)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Scaling Deep Learning Computation over the Inter-Core Connected Intelligence Processor" was published by researchers at UIUC and Microsoft Research. Abstract "As AI chips incorporate numerous parallelized cores to scale deep learning (DL) computing, inter-core communication is enabled recently by employing high-bandwidth and low-latency interconnect links on th... » read more

Characterizing Three Supercomputers: Multi-GPU Interconnect Performance
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "Exploring GPU-to-GPU Communication: Insights into Supercomputer Interconnects" was published by researchers at Sapienza University of Rome, University of Trento, Vrije Universiteit Amsterdam, ETH Zurich, CINECA, University of Antwerp, IBM Research Europe, HPE Cray, and NVIDIA. Abstract "Multi-GPU nodes are increasingly common in the rapidly evolving landscape... » read more

6G And Beyond: Overall Vision And Survey of Research
By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new 92 page technical paper titled "6G: The Intelligent Network of Everything -- A Comprehensive Vision, Survey, and Tutorial" was published by IEEE researchers at Finland's University of Oulu. Abstract "The global 6G vision has taken its shape after years of international research and development efforts. This work culminated in ITU-R's Recommendation on "IMT-2030 Framework". While the d... » read more

On-Chip Communication For Programmable Accelerators In Heterogeneous SoCs (Columbia, IBM)
By Technical Paper Link - 10 Jul, 2024 - Comments: 0

A technical paper titled “Towards Generalized On-Chip Communication for Programmable Accelerators in Heterogeneous Architectures” was published by researchers at Columbia University and IBM Thomas J. Watson Research Center. Abstract: "We present several enhancements to the open-source ESP platform to support flexible and efficient on-chip communication for programmable accelerators in het... » read more

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