category: Communication/Data Movement

category: IoT, Security & Automotive

3D Photonic Integration For Ultra-Low-Energy, High-Bandwidth Interchip Data Links (Columbia et al.)
By Linda Christensen - 23 Mar, 2025 - Comments: 0

A new technical paper titled "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links" was published by researchers at Columbia University, Cornell University, Air Force Research Laboratory Information Directorate and Dartmouth College. Abstract "Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by ... » read more

Review Of Recent Advancements in THz-based 6G: Devices, Circuits, Antennas and Packaging
By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "A Survey on Advancements in THz Technology for 6G: Systems, Circuits, Antennas, and Experiments" was published by UCLA. Abstract "Terahertz (THz) carrier frequencies (100 GHz to 10 THz) have been touted as a source for unprecedented wireless connectivity and high-precision sensing, courtesy of their wide bandwidth availability and small wavelengths. However, no... » read more

Potential of Wireless Interconnects For Improving Performance And Flexibility Of Multi-Chip AI Accelerators
By Technical Paper Link - 07 Feb, 2025 - Comments: 0

A new technical paper titled "Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "The insatiable appetite of Artificial Intelligence (AI) workloads for computing power is pushing the industry to develop faster and more efficient accelerators. The rigidity of custom hardware, however, conflict... » read more

Co-Packaged Optics To Train/Run GenAI Models in Data Centers (IBM)
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications" was published by researchers at IBM. Abstract "We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transf... » read more

Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically" was published by researchers at University of Cambridge and GlitterinTech Limited. Abstract "Silicon photonic switches are widely considered as a cost-effective solution for addressing the ever-growing data traffic in datacenter networks, as they offer unique advantages such as low power co... » read more

CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "The Hitchhiker’s Guide to Programming and Optimizing CXL-Based Heterogeneous Systems" was published by researchers at UC San Diego, Samsung, SK hynix. Abstract "We present a thorough analysis of the use of CXL-based heterogeneous systems. We built a cluster of server systems that combines different vendor's CPUs and various types of CXL devices. We further ... » read more

Visualization of Photoexcited Charges Moving Across the Interface of Si/Ge
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A technical paper titled "Imaging hot photocarrier transfer across a semiconductor heterojunction with ultrafast electron microscopy" was published by researchers at UC Santa Barbara and UCLA. "In this work, we apply scanning ultrafast electron microscopy to provide a holistic view of photoexcited charge dynamics in a Si/Ge heterojunction. We find that the built-in potential and the band off... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies
By Technical Paper Link - 25 Sep, 2024 - Comments: 0

A new technical paper titled "Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz" was published by researchers at NIST. Abstract "We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave ele... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)
By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

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