category: Communication/Data Movement

category: IoT, Security & Automotive

Characterization, Modeling, And Model Parameter Extraction Of 5nm FinFETs
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “A Comprehensive RF Characterization and Modeling Methodology for the 5nm Technology Node FinFETs” was published by researchers at IIT Kanpur, MaxLinear Inc., and University of California Berkeley. Abstract: "This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry stan... » read more

Using Deep Learning to Secure The CAN Bus From Advanced Intrusion Attacks
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “CANShield: Deep Learning-Based Intrusion Detection Framework for Controller Area Networks at the Signal-Level” was published by researchers at Virginia Tech and others. "As modern vehicles become more connected to external networks, the attack surface of the CAN bus system grows drastically. To secure the CAN bus from advanced intrusion attacks, we propose a sig... » read more

Noise Parameter Survey Of Millimeter Wave GaN HEMT Technologies
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “A Survey of GaN HEMT Technologies for Millimeter-Wave Low Noise Applications” was published by researchers at Wright-Patterson AFB, Teledyne Scientific, HRL Laboratories, BAE Systems, Pseudolithic, Northrop Grumman Corporation, and University of California Santa Barbara. "This article presents a set of measured benchmarks for the noise and gain performance of si... » read more

Neuromorphic Hardware Accelerator For Heterogeneous Many-Accelerator SoCs
By Technical Paper Link - 28 Sep, 2023 - Comments: 0

A technical paper titled “SpikeHard: Efficiency-Driven Neuromorphic Hardware for Heterogeneous Systems-on-Chip” was published by researchers at Columbia University. Abstract: "Neuromorphic computing is an emerging field with the potential to offer performance and energy-efficiency gains over traditional machine learning approaches. Most neuromorphic hardware, however, has been designed wi... » read more

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt "In this work, we propose a new task mapping heuristic that leverages in-package wireless t... » read more

Automotive Intrusion Detection Methodologies (TU Denmark)
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A new technical paper titled "Intrusion Detection in the Automotive Domain: A Comprehensive Review" was published by researchers at DTU Compute Technical University of Denmark Abstract "The automotive domain has realized amazing advancements in communication, connectivity, and automation— and at a breakneck pace. Such advancements come with ample benefits, such as the reduction of traffic... » read more

Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications” was published by researchers at Georgia Institute of Technology. Abstract: "This paper thoroughly investigates material characterization, reliability evaluation, fabrication, and assembly processes of additively manufa... » read more

New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed 
By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

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