category: Communication/Data Movement

category: IoT, Security & Automotive

New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed 
By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

NoC Obfuscation For Protecting Against Reverse Engineering Attacks (U. Of Florida)
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "ObNoCs: Protecting Network-on-Chip Fabrics Against Reverse-Engineering Attacks" was published by researchers at University of Florida. Abstract: "Modern System-on-Chip designs typically use Network-on-Chip (NoC) fabrics to implement coordination among integrated hardware blocks. An important class of security vulnerabilities involves a rogue foundry reverse-engineeri... » read more

A Chiplet-Based Supercomputer For Generative LLMs That Optimizes Total Cost of Ownership
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models" was published by researchers at University of Washington and University of Sydney. Abstract: "Large language models (LLMs) such as ChatGPT have demonstrated unprecedented capabilities in multiple AI tasks. However, hardware inefficiencies have become a significant factor limiting ... » read more

An Efficient Method To Develop, Evaluate, and Demonstrate Connected And Autonomous Driving 
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Vehicle-in-Virtual-Environment (VVE) Method for Autonomous Driving System Development, Evaluation and Demonstration" was published by researchers at Ohio State University. Abstract: "The current approach to connected and autonomous driving function development and evaluation uses model-in-the-loop simulation, hardware-in-the-loop simulation and limited proving ground... » read more

Organic Bioelectronic Device To Record And Transmit Brain Signals Plus Provide Power
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Integrated internal ion-gated organic electrochemical transistors for stand-alone conformable bioelectronics" was published by researchers at Columbia University and Columbia University Medical Center. Abstract: "Organic electronics can be biocompatible and conformable, enhancing the ability to interface with tissue. However, the limitations of speed and integration ... » read more

Impact of CMOS Image Sensors Fabrication Processes On The Quality Of Smartphone Pictures
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. Abstract: "CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of ima... » read more

The Implementation Of Cooperative Collision Avoidance For Connected Vehicles (Ohio State University)
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Cooperative Collision Avoidance in a Connected Vehicle Environment” was published by researchers at Ohio State University. Abstract: "Connected vehicle (CV) technology is among the most heavily researched areas in both the academia and industry. The vehicle to vehicle (V2V), vehicle to infrastructure (V2I) and vehicle to pedestrian (V2P) communication capabilitie... » read more

Impact of Semiconductor Optical Amplifers On Performance & Power Consumption in Data Centers (UCSB)
By Technical Paper Link - 22 May, 2023 - Comments: 0

A new technical paper titled "Integrated SOAs enable energy-efficient intra-data center coherent links" was published by researchers at UC Santa Barbara. "In this work, we analyze the impact of integrated semiconductor optical amplifiers (SOAs) on link performance and power consumption, and describe the optimal design spaces for low-cost and energy-efficient coherent links. Placing SOAs afte... » read more

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