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Wafer Scale Transfer of 2D Materials, Graphene


A new technical paper titled "Assessment of Wafer-Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements" was published by researchers at Infineon Technologies AG, RWTH Aachen University, Protemics, and Advantest. Abstract "Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requ... » read more

Mitigating Silent Data Corruptions in High Performance Computing


A new technical paper titled "Mitigating silent data corruptions in HPC applications across multiple program inputs" was published by researchers at University of Iowa, Baidu Security, and Argonne National Lab. The paper was a Best Paper finalist at SC22. The researchers "propose MinpSID, an automated SID framework that automatically identifies and re-prioritizes incubative instructions in a... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies


A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

Technique For Printing Electronic Circuits Onto Curved & Corrugated Surfaces Using Metal Nanowires (NC State)


A technical paper titled "Curvilinear soft electronics by micromolding of metal nanowires in capillaries" was published by researchers at North Carolina State University. “We’ve developed a technique that doesn’t require binding agents and that allows us to print on a variety of curvilinear surfaces,” says Yuxuan Liu, first author of the paper and a Ph.D. student at NC State in this ... » read more

New Technique For Making Thin Films of Perovskite Oxide Semiconductors


A technical paper titled "Freestanding epitaxial SrTiO3  nanomembranes via remote epitaxy using hybrid molecular beam epitaxy" was published by researchers at University of Minnesota Twin Cities, Pacific Northwest National Laboratory, and University of Wisconsin–Madison. The researchers developed a new technique for making thin films of perovskite oxide semiconductors.  The development c... » read more

Graphene-Based Electronics (Georgia Tech)


A technical paper titled "An epitaxial graphene platform for zero-energy edge state nanoelectronics" was published by researchers at Georgia Tech, Tianjin University, CNRS, Synchrotron SOLEIL, National High Magnetic Field Laboratory and others. “Graphene’s power lies in its flat, two-dimensional structure that is held together by the strongest chemical bonds known,” said Walter de Heer... » read more

Scalable Technique Producing Thin Lightweight Solar Cells That Turn Any Surface Into A Power Source (MIT)


A new technical paper titled "Printed Organic Photovoltaic Modules on Transferable Ultra-thin Substrates as Additive Power Sources" was published by researchers at MIT. "These durable, flexible solar cells, which are much thinner than a human hair, are glued to a strong, lightweight fabric, making them easy to install on a fixed surface. They can provide energy on the go as a wearable power ... » read more

Graphene Devices: Suppressing Vibrations By Adding Vibrations (FLEET)


A technical paper titled "Passivating Graphene and Suppressing Interfacial Phonon Scattering with Mechanically Transferred Large-Area Ga2O3" was published by researchers at ARC Centre of Excellence in Future Low-Energy Electronics Technologies (FLEET), Monash University and University of Melbourne. According to FLEET's news article, the research found: -Ultra-thin, liquid-metal-printed oxid... » read more

New Method to Measure, At The Wafer Scale, Direct Bonding Energies (CEA-LETI)


A new technical paper titled "Double cantilever beam bonding energy measurement using confocal IR microscopy" was published by researchers at Univ. Grenoble Alpes, CEA-LETI and SOITEC, Parc Technologique des Fontaines. "A new technique is assessed in order to measure, at the wafer scale, direct bonding energies. It is derived from the standard Double Cantilever Beam (DCB) method and uses int... » read more

Rubbery Schottky Diodes Based on Soft, Stretchy Electronic Materials (Penn State)


A new technical paper titled "Fully rubbery Schottky diode and integrated devices" was published by researchers at Penn State University. The Office of Naval Research and the National Science Foundation funded this research. "Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and... » read more

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