category: Manufacturing

category: IoT, Security & Automotive

Monolithic 3D TFT Integration at Room Temperature, Used to Stack 10 Vertical Layers
By Technical Paper Link - 12 Jul, 2024 - Comments: 0

A new technical paper titled "Three-dimensional integrated metal-oxide transistors" was published by researchers at KAUST (King Abdullah University of Science and Technology). Abstract "The monolithic three-dimensional vertical integration of thin-film transistor (TFT) technologies could be used to create high-density, energy-efficient and low-cost integrated circuits. However, the develo... » read more

Interconnects: Criteria For Alternative Metal Benchmarking And Selection (Imec, KU Leuven)
By Technical Paper Link - 19 Jun, 2024 - Comments: 0

A technical paper titled “Selecting Alternative Metals for Advanced Interconnects” was published by researchers at imec and KU Leuven. Abstract “Today, interconnect resistance and reliability are key limiters for the performance of advanced CMOS circuits. As transistor scaling is slowing, interconnect scaling has become the main driver for circuit miniaturization, and interconnect lim... » read more

Plasma Etching : Challenges And Options Going Forward (UMD, IBM, Lam Research, Intel, Samsung et al.)
By Technical Paper Link - 18 Jun, 2024 - Comments: 0

A new technical paper titled "Future of plasma etching for microelectronics: Challenges and opportunities" was published by researchers from numerous academic institutions and companies, including University of Maryland, IBM, Arkema, UCLA, Lam Research, Intel Corporation, Samsung, Air Liquide, Sony, and many others. Abstract: "Plasma etching is an essential semiconductor manufacturing techn... » read more

Device Characteristics of GAA-Structured CMOS and CTFET Under Varying Temperatures
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "Vertical-Stack Nanowire Structure of MOS Inverter and TFET Inverter in Low-temperature Application" was published by researchers at National Tsing Hua University and National United University in Taiwan. Abstract "Tunneling field effect transistors (TFET) have emerged as promising candidates for integrated circuits beyond conventional metal oxide semiconductor ... » read more

Imperceptible, Lightweight Sensors Directly Printed on Biological Surfaces
By Technical Paper Link - 28 May, 2024 - Comments: 0

A new technical paper titled "Imperceptible augmentation of living systems with organic bioelectronic fibres" was published by researchers at University of Cambridge and University of Macau. Abstract "The functional and sensory augmentation of living structures, such as human skin and plant epidermis, with electronics can be used to create platforms for health management and environmental m... » read more

Demonstrating The Feasibility Of The Foundry Model For Flexible Thin-Film Electronics 
By Technical Paper Link - 15 May, 2024 - Comments: 0

A technical paper titled “Multi-project wafers for flexible thin-film electronics by independent foundries” was published by researchers at KU Leuven and imec. Abstract: "Flexible and large-area electronics rely on thin-film transistors (TFTs) to make displays, large-area image sensors, microprocessors, wearable healthcare patches, digital microfluidics and more. Although silicon-based co... » read more

Testing/Probing Single Electrons Across 300mm Spin Qubit Wafers (Intel)
By The SE Staff - 15 May, 2024 - Comments: 0

A technical paper titled “Probing single electrons across 300-mm spin qubit wafers” was published by researchers at Intel Corporation. Abstract: "Building a fault-tolerant quantum computer will require vast numbers of physical qubits. For qubit technologies based on solid-state electronic devices, integrating millions of qubits in a single processor will require device fabrication to reac... » read more

Controllable Interaction Between Two Hole Spin Qubits In A Conventional Silicon Transistor
By Technical Paper Link - 15 May, 2024 - Comments: 0

A technical paper titled “Anisotropic exchange interaction of two hole-spin qubits” was published by researchers at University of Basel and IBM Research Europe-Zurich. Abstract: "Semiconductor spin qubits offer the potential to employ industrial transistor technology to produce large-scale quantum computers. Silicon hole spin qubits benefit from fast all-electrical qubit control and sweet... » read more

Synthesis Of Goldene Comprising Single-Atom Layer Gold (Linköping University)
By Technical Paper Link - 07 May, 2024 - Comments: 0

A technical paper titled “Synthesis of goldene comprising single-atom layer gold” was published by researchers at Linköping University (Sweden). Abstract: "The synthesis of monolayer gold has so far been limited to free-standing several-atoms-thick layers, or monolayers confined on or inside templates. Here we report the exfoliation of single-atom-thick gold achieved through wet-chemical... » read more

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)
By Technical Paper Link - 30 Apr, 2024 - Comments: 0

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: "The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into h... » read more

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