category: Manufacturing

category: IoT, Security & Automotive

Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle
By Technical Paper Link - 18 Mar, 2023 - Comments: 0

A new technical paper titled "Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology" was published by researchers at University of Ottawa, Sungkyunkwan University, and Hanbat National University. Abstract "Extreme ultraviolet lithography (EUVL) is widely employed in the electronics, automotive, military, and AI computing areas for IC chip fabrication. A pellicl... » read more

Evaluation of the Thermomechanical Reliability of Electronic Packages Using Virtual Prototyping
By Technical Paper Link - 18 Mar, 2023 - Comments: 0

A new technical paper titled "Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies" was published by Fraunhofer ENAS. Abstract "A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” He... » read more

More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering" was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. Abstract: "In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by ima... » read more

Ferroelectric HEMT Reconfigurable Transistor (U. of Michigan)
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "Fully epitaxial, monolithic ScAlN/AlGaN/GaN ferroelectric HEMT" was published by researchers at University of Michigan. “We can make our ferroelectric HEMT reconfigurable,” That means it can function as several devices, such as one amplifier working as several amplifiers that we can dynamically control. This allows us to reduce the circuit area and lower the... » read more

Reducing Contact Resistance in Developing Transistors Based On 2D Materials
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "WS2 Transistors with Sulfur Atoms Being Replaced at the Interface: First-Principles Quantum-Transport Study" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Reducing the contact resistance is one of the major challenges in developing transistors based on two-dimensional materials. In this study, we perform first-principles ... » read more

Virtual Process Game To Benchmark Performance of Humans And Computers For Design Of A Semiconductor Fabrication Process
By Technical Paper Link - 09 Mar, 2023 - Comments: 0

A new technical paper titled "Human–machine collaboration for improving semiconductor process development" was published by researchers at Lam Research. Abstract: "One of the bottlenecks to building semiconductor chips is the increasing cost required to develop chemical plasma processes that form the transistors and memory storage cells These processes are still developed manually using h... » read more

Large Area Synthesis of 2D Material Hexagonal Boron Nitride, Improving Device Characteristics of Graphene
By Technical Paper Link - 08 Mar, 2023 - Comments: 0

A new technical paper titled "Large-area synthesis and transfer of multilayer hexagonal boron nitride for enhanced graphene device arrays" was published by researchers at Kyushu University, National Institute of Advanced Industrial Science and Technology (AIST), and Osaka University. Abstract "Multilayer hexagonal boron nitride (hBN) can be used to preserve the intrinsic physical properti... » read more

Printed Electronics: Direct Flipchip Bonding of Ultra-Thin Chip On A Recently-Developed Stretchable Substrate
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A new technical paper titled "Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation" was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies. Abstract "Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-... » read more

Fabricating Multi-Walled Carbon Nanotubes On Plastic Film
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A new technical paper titled "Direct formation of carbon nanotube wiring with controlled electrical resistance on plastic films" was published by researchers at Tokyo University of Science. The paper states, "we have developed a simple method to fabricate multi-walled carbon nanotube (MWNT) wiring on a plastic film at room temperature under atmosphere pressure. By irradiating a MWNT thin fil... » read more

Chiplet Placer with Thermal Consideration for 2.5D ICs
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration" was published by researchers at National Yang Ming Chiao Tung University (Taiwan). Abstract "This work develops an efficient chiplet placer with thermal consideration for 2.5D ICs. Combining the sequence-pair based tree, branch-and-bound method, and advanced placement/pruning... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy