category: Manufacturing

category: IoT, Security & Automotive

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

Measuring 3D Sidewall Topography & LER for Photoresist Patterns Using Tip-Tilting AFM Technology
By Technical Paper Link - 19 Feb, 2023 - Comments: 0

A new technical paper titled "Enhancing the precision of 3D sidewall measurements of photoresist using atomic force microscopy with a tip-tilting technique" by researchers at National Metrology Institute of Japan (NMIJ) and National Institute of Advanced Industrial Science and Technology (AIST). "We have developed a technique for measuring the sidewall of the resist pattern using atomic for... » read more

Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV Aspect Ratio And Annealing Temperature
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A technical paper titled "Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications" was published by researchers at National Yang Ming Chiao Tung University. Abstract: "The stress of TSV with different dimensions under annealing condition has been investigated. Since the application of TSV and bonding technology has demonstrated a promising approach for ... » read more

ILP-Based Router for Wire-Bonding FBGA Packaging Design
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more

Modeling and Thermal Analysis of 3DIC
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers" was published by researchers at UT Arlington. "This work presents a theoretical model to determine the steady state temperature distribution in a general M-layer structure with spatial variation in thermal contact resistance between adjacent la... » read more

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper titled "Thickness scaling down to 5 nm of ferroelectric ScAlN on CMOS compatible molybdenum grown by molecular beam epitaxy" was published by researchers at University of Michigan, with DARPA funding. "Ferroelectric semiconductors stand out from others because they can sustain an electrical polarization, like the electric version of magnetism. But unlike a fridge magn... » read more

Detecting Hardware Trojans In a RISC-V Core’s Post-Layout Phase
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper "Trojan-D2: Post-Layout Design and Detection of Stealthy Hardware Trojans - A RISC-V Case Study" was published by researchers at University of Bremen, DFKI GmbH, and the German Aerospace Center. Abstract: "With the exponential increase in the popularity of the RISC-V ecosystem, the security of this platform must be re-evaluated especially for mission-critical and IoT d... » read more

Wafer Scale Transfer of 2D Materials, Graphene
By Technical Paper Link - 29 Jan, 2023 - Comments: 0

A new technical paper titled "Assessment of Wafer-Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements" was published by researchers at Infineon Technologies AG, RWTH Aachen University, Protemics, and Advantest. Abstract "Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requ... » read more

Mitigating Silent Data Corruptions in High Performance Computing
By Technical Paper Link - 29 Jan, 2023 - Comments: 0

A new technical paper titled "Mitigating silent data corruptions in HPC applications across multiple program inputs" was published by researchers at University of Iowa, Baidu Security, and Argonne National Lab. The paper was a Best Paper finalist at SC22. The researchers "propose MinpSID, an automated SID framework that automatically identifies and re-prioritizes incubative instructions in a... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies
By Technical Paper Link - 11 Jan, 2023 - Comments: 0

A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy