category: Manufacturing

category: IoT, Security & Automotive

Define & Grow III–V Vertical Nanowires At A High Footprint Density on a Si Platform
By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New technical paper titled "Directed Self-Assembly for Dense Vertical III–V Nanowires on Si and Implications for Gate All-Around Deposition" is published from researchers at Lund University in Sweden. Abstract: "Fabrication of next generation transistors calls for new technological requirements, such as reduced size and increased density of structures. Development of cost-effective proc... » read more

Identifying PCB Defects with a Deep Learning Single-Step Detection Model
By Technical Paper Link - 22 Jul, 2022 - Comments: 0

This new technical paper titled "End-to-end deep learning framework for printed circuit board manufacturing defect classification" is from researchers at École de technologie supérieure (ÉTS) in Montreal, Quebec. Abstract "We report a complete deep-learning framework using a single-step object detection model in order to quickly and accurately detect and classify the types of manufacturi... » read more

Publicly Available Dataset for PCB X-Ray Inspection (FICS- University of Florida)
By Technical Paper Link - 19 Jul, 2022 - Comments: 0

Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled "FICS PCB X-ray: A dataset for automated printed circuit board inter-layers inspection." Abstract "Advancements in computer vision and machine learning breakthroughs over the years have paved the way for automated X-ray inspection (AXI) of printed circuit bo... » read more

Film Failure in Multilayer Systems for Semiconductor Devices
By Technical Paper Link - 18 Jul, 2022 - Comments: 0

Researchers at MIT, Yonsei University (Seoul, Korea) just published this technical paper titled "Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices." According to the abstract "In this work, the effect of thermomechanical stress on the failure of multilayered thin films on Si substrates was studied using analytical calculations and various thermomechanical tests." ... » read more

FEOL Nanosheet Process Flow & Challenges Requiring Metrology Solutions (IBM Watson)
By Technical Paper Link - 08 Jul, 2022 - Comments: 0

New technical paper titled "Review of nanosheet metrology opportunities for technology readiness," from researchers at IBM Thomas J. Watson Research Ctr. (United States). Abstract (partial): "More than previous technologies, then, nanosheet technology may be when some offline techniques transition from the lab to the fab, as certain critical measurements need to be monitored in real time. T... » read more

Attenuated Phase Shift Masks (attPSM) For EUV (Fraunhofer IISB)
By Technical Paper Link - 08 Jul, 2022 - Comments: 0

New research paper titled "Attenuated phase shift masks: a wild card resolution enhancement for extreme ultraviolet lithography?," from researchers at Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany). Aim: "We review published research on attenuated phase shift masks (attPSM) for EUV with special emphasis on modeling and fundamental understanding of the ... » read more

One Transistor Process-in-Memory Device Strategy w/ Multi-Functional Multi-Gate One-transistor (MGT) Design of Multiple Electrodes
By Technical Paper Link - 04 Jul, 2022 - Comments: 0

New technical paper titled "Multi-functional multi-gate one-transistor process-in-memory electronics with foundry processing and footprint reduction" from researchers at Ningbo Institute of Materials Technology and Engineering (Chinese Academy of Sciences), Center of Materials Science and Optoelectronics Engineering (University of Chinese Academy of Sciences), Shanghai Institute of Microsystem ... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

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