category: Manufacturing

category: IoT, Security & Automotive

SIA’s Report On the State of the U.S. Semiconductor Industry
By Technical Paper Link - 18 Sep, 2024 - Comments: 0

The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report this week, highlighting opportunities for growth, current and emerging challenges, and relevant metrics.  The report reviews the progress made on implementation of the CHIPS Act and associated manufacturing incentives. Supply chain rebalancing, workforce challenges, geopolitics and globa... » read more

Scalable Fabrication of Graphene FETs on Non-Planar Surfaces (Imperial College London)
By Technical Paper Link - 12 Sep, 2024 - Comments: 0

A new technical paper titled "Fabrication of graphene field effect transistors on complex non-planar surfaces" was published by researchers at Imperial College London. Abstract "Graphene field effect transistors (GFETs) are promising devices for biochemical sensing. Integrating GFETs onto complex non-planar surfaces could uncap their potential in emerging areas of wearable electronics, such... » read more

Relative Humidity in Conductive Atomic Force Microscopy (KAUST)
By Technical Paper Link - 11 Sep, 2024 - Comments: 0

A new technical paper titled "The Effect of Relative Humidity in Conductive Atomic Force Microscopy" was published by researchers at KAUST. Abstract "Conductive atomic force microscopy (CAFM) analyzes electronic phenomena in materials and devices with nanoscale lateral resolution, and it is widely used by companies, research institutions, and universities. Most data published in the field o... » read more

Block Copolymer and Sub-10nm Line Patterns By Directed Self-Assembly (Tokyo Tech)
By Technical Paper Link - 11 Sep, 2024 - Comments: 0

A technical paper titled "Chemically tailored block copolymers for highly reliable sub-10-nm patterns by directed self-assembly" was published by researchers at Tokyo Institute of Technology and Tokyo Ohka Kogyo Co. Abstract "While block copolymer (BCP) lithography is theoretically capable of printing features smaller than 10 nm, developing practical BCPs for this purpose remains challeng... » read more

Steps to Fabricate Nanotips Overhanging From Chip Edge By a Few Micrometers (CNRS, CEA-Leti)
By Technical Paper Link - 10 Sep, 2024 - Comments: 0

A new technical paper titled "Suspended tip overhanging from chip edge for atomic force microscopy with an optomechanical resonator" was published by researchers at Lab. d'Analyse et d'Architecture des Systèmes du CNRS and CEA-LETI. Abstract Raising the mechanical frequency of atomic force microscopy (AFM) probes to increase the measurement bandwidth has been a long-standing expectation in... » read more

New Strategies For Enhancing Transport Properties of Conducting Polymers (Cambridge, et al.)
By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Non-equilibrium transport in polymer mixed ionic–electronic conductors at ultrahigh charge densities" was published by researchers at Cambridge University, Grenoble Alpes University, CNRS, Humboldt-Universität zu Berlin, et al. Abstract "Conducting polymers are mixed ionic–electronic conductors that are emerging candidates for neuromorphic computing, bioel... » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Analysis of the Errors of High-Fidelity Two-Qubit Gates in Silicon Quantum Dots (UNSW et al.)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Assessment of the errors of high-fidelity two-qubit gates in silicon quantum dots" was published by researchers at UNSW, Diraq, Sandia National Laboratories, Keio University, Leibniz-Institut für Kristallzüchtung and others. Abstract "Achieving high-fidelity entangling operations between qubits consistently is essential for the performance of multi-qubit syst... » read more

Buried Si/SiGe Interfaces Investigated Using Soft X-Ray Reflectometry and STEM-EDX
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "Interface sharpness in stacked thin film structures: a comparison of soft X-ray reflectometry and transmission electron microscopy" was published by researchers at Physikalisch-Technische Bundesanstalt (PTB), imec, and Thermo Fisher Scientific Inc. The paper states: "A key element of semiconductor fabrication is the precise deposition of thin films. Among other... » read more

5 Novel Layout Design Methodologies For The 3nm Nanosheet FET Library (Samsung, KNU)
By Technical Paper Link - 13 Aug, 2024 - Comments: 0

A new technical paper titled "Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node" was published by researchers at Samsung Electronics and Kyungpook National University (KNU). Abstract: "As the technology nodes approach 3 nm and beyond, nanosheet FETs (NSFETs) are replacing FinFETs. However, despite the migration of devices ... » read more

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