category: Memory

category: IoT, Security & Automotive

Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)
By Technical Paper Link - 30 Dec, 2024 - Comments: 0

A new technical paper titled "Memory-Centric Computing: Recent Advances in Processing-in-DRAM" was published by researchers at ETH Zurich. Abstract "Memory-centric computing aims to enable computation capability in and near all places where data is generated and stored. As such, it can greatly reduce the large negative performance and energy impact of data access and data movement, by 1) ... » read more

2D Ferroelectric Field-Effect Transistors (Penn State, U. of Minnesota)
By Technical Paper Link - 30 Dec, 2024 - Comments: 0

A new technical paper titled "Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 nanomembranes at sub-ambient temperatures" was published by researchers at Penn State University and University of Minnesota. Abstract "Incipient ferroelectricity bridges traditional dielectrics and true ferroelectrics, enabling advanced electronic and memory devices. Firstly... » read more

Advancements in SOT-MRAM Device Development (imec)
By Technical Paper Link - 28 Dec, 2024 - Comments: 0

A technical paper titled "Recent progress in spin-orbit torque magnetic random-access memory" was recently published by imec. Abstract "Spin-orbit torque magnetic random-access memory (SOT-MRAM) offers promise for fast operation and high endurance but faces challenges such as low switching current, reliable field free switching, and back-end of line manufacturing processes. We review rece... » read more

CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)
By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors" was published by researchers at Micron and Intel. Abstract "High-Performance Computing (HPC) and Artificial Intelligence (AI) workloads typically demand substantial memory bandwidth and, to a degree, memory capacity. CXL memory expansion modules, also known... » read more

Nonvolatile Electrochemical Memory Cell For Temperatures Up To 600°C (U. Of Michigan, Sandia)
By Technical Paper Link - 18 Dec, 2024 - Comments: 0

A new technical paper titled "Nonvolatile electrochemical memory at 600°C enabled by composition phase separation" was published by researchers at University of Michigan and Sandia National Laboratories. "Moore’s law has led to monumental advances in computing over the past 50 years. However, one shortcoming of silicon-based logic and memory devices is their limited temperature range, typ... » read more

Promising Materials Beyond Silicon (TI, AIXTRON, imec)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "Future materials for beyond Si integrated circuits: a Perspective" was published by researchers at Texas Instruments, AIXTRON SE and imec. Abstract: "The integration of novel materials has been pivotal in advancing Si-based devices ever since Si became the preferred material for transistors, and later, integrated circuits. New materials have rapidly been adopte... » read more

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
By Technical Paper Link - 27 Nov, 2024 - Comments: 0

A new technical paper titled "System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory" was published by researchers at imec, INESC-ID, Université Libre de Bruxelles, et al. "In this paper, we present an system-technology co-optimization (STCO) framework that interfaces with workload-driven system scaling challenges and physical design-enab... » read more

Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A new technical paper titled "Pie: Pooling CPU Memory for LLM Inference" was published by researchers at UC Berkeley. Abstract "The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill over to CPU memory; however, traditional GPU-CPU memory swapping ofte... » read more

Monitor Etch Defects on Dies in the Outer Regions Of The Wafer Using ISR
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A technical paper titled "Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral imaging and deep learning" was published by researchers at Samsung Electronics. Abstract: "We have developed an imaging spectroscopic reflectometry (ISR) method based on hyperspectral imaging and deep learning to detect defects in the bottom region of high-aspect-ratio nan... » read more

Distributed Shared Memory That Enlarges Effective Memory Capacity Through Intelligent Tiered DRAM and Storage Management (IIT)
By Technical Paper Link - 13 Nov, 2024 - Comments: 0

A new technical paper titled "MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads" was published by researchers at Illinois Institute of Technology. "In this work, we propose MegaMmap: a software distributed shared memory (DSM) that enlarges effective memory capacity through intelligent tiered DRAM and storage management. MegaMmap provides workload-aware d... » read more

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