Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)


A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

Low-Cost TSV Repair Architecture Specialized for Highly Clustered TSV Faults Within HBM


A new technical paper titled "Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults" was published by researchers at Yonsei University. Abstract "Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the entire chips. H... » read more

Temporal Variation in DRAM Read Disturbance in DDR4 and HBM2 (ETH Zurich, Rutgers)


A new technical paper titled "Variable Read Disturbance: An Experimental Analysis of Temporal Variation in DRAM Read Disturbance" was published by researchers at ETH Zurich and Rutgers University. Abstract "Modern DRAM chips are subject to read disturbance errors. State-of-the-art read disturbance mitigations rely on accurate and exhaustive characterization of the read disturbance threshold... » read more

HW-Aligned Sparse Attention Architecture For Efficient Long-Context Modeling (DeepSeek et al.)


A new technical paper titled "Native Sparse Attention: Hardware-Aligned and Natively Trainable Sparse Attention" was published by DeepSeek, Peking University and University of Washington. Abstract "Long-context modeling is crucial for next-generation language models, yet the high computational cost of standard attention mechanisms poses significant computational challenges. Sparse attention... » read more

Modeling and Simulation of NVM Technologies: Tutorial (TU Dormand, TU Dresden, KIT, FAU)


A new technical paper titled "Modeling and Simulating Emerging Memory Technologies: A Tutorial" was published by researchers at TU Dortmund, TU Dresden, Karlsruhe Institute of Technology (KIT) and FAU ErlangenNürnberg. "This tutorial presents a simulation toolchain through four detailed case studies, showcasing its applicability to various domains of system design, including hybrid main-mem... » read more

Demonstration Of An ALD IWO Channel In A GAA Nanosheet FET Structure (Georgia Tech, Micron)


A new technical paper titled "First Demonstration of High-Performance and Extremely Stable W-Doped In2O3  Gate-All-Around (GAA) Nanosheet FET" was published by researchers at Georgia Institute of Technology and Micron. Abstract "We demonstrate a gate-all-around (GAA) nanosheet FET featuring an atomic layer-deposited (ALD) tungsten (W)-doped indium oxide (In2O3), or indium tungsten oxide ... » read more

Uncore Frequency Scaling For Energy Optimization In Heterogeneous Systems (UIC, Argonne)


A new technical paper titled "Exploring Uncore Frequency Scaling for Heterogeneous Computing" was published by researchers at University of Illinois Chicago and Argonne National Laboratory. Abstract "High-performance computing (HPC) systems are essential for scientific discovery and engineering innovation. However, their growing power demands pose significant challenges, particularly as sys... » read more

Rowhammer Mitigation With Adaptive Refresh Management Optimization (KAIST, Sk hynix)


A new technical paper titled "Securing DRAM at Scale: ARFM-Driven Row Hammer Defense with Unveiling the Threat of Short tRC Patterns" was published by researchers at KAIST and Sk hynix. Abstract (partial) "To address the issue of powerful row hammer (RH) attacks, our study involved an extensive analysis of the prevalent attack patterns in the field. We discovered a strong correlation betwee... » read more

Wafer-Scale Computing for LLMs (U. of Edinburgh, Microsoft)


A new technical paper titled "WaferLLM: A Wafer-Scale LLM Inference System" was published by researchers at University of Edinburgh and Microsoft Research. Abstract "Emerging AI accelerators increasingly adopt wafer-scale manufacturing technologies, integrating hundreds of thousands of AI cores in a mesh-based architecture with large distributed on-chip memory (tens of GB in total) and ultr... » read more

Power Delivery Challenges in 3D HI CIM Architectures for AI Accelerators (Georgia Tech)


A new technical paper titled "Co-Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators" was published by researchers at Georgia Tech. Abstract: "3D heterogeneous integration (3D HI) offers promising solutions for incorporating substantial embedded memory into cutting-edge analog compute-in-memory (CIM) AI accelerators, ad... » read more

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