category: Optoelectronics / Photonics

category: IoT, Security & Automotive

Patterning Doping On Very Large Monolayer MoS2 (NREL)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "Spatially Precise Light-Activated Dedoping in Wafer-Scale MoS2 Films" was published by researchers at National Renewable Energy Laboratory (NREL) and Renewable & Sustainable Energy Institute (RASEI). "In this work, we unravel the mechanism that drives PL* changes of MoS2 monolayers under laser illumination in ambient conditions. We demonstrate the critical ... » read more

New Class Of Materials With Increased Band Gap (U. of Minnesota, Caltech)
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Deep-ultraviolet transparent conducting SrSnO3 via heterostructure design" was published by researchers at University of Minnesota–Twin Cities and Caltech. The researchers "looked at creating a new class of materials with increased “band gap,” enhancing both transparency and conductivity. The new material is a transparent conducting oxide, created with a s... » read more

Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically" was published by researchers at University of Cambridge and GlitterinTech Limited. Abstract "Silicon photonic switches are widely considered as a cost-effective solution for addressing the ever-growing data traffic in datacenter networks, as they offer unique advantages such as low power co... » read more

Visualization of Photoexcited Charges Moving Across the Interface of Si/Ge
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A technical paper titled "Imaging hot photocarrier transfer across a semiconductor heterojunction with ultrafast electron microscopy" was published by researchers at UC Santa Barbara and UCLA. "In this work, we apply scanning ultrafast electron microscopy to provide a holistic view of photoexcited charge dynamics in a Si/Ge heterojunction. We find that the built-in potential and the band off... » read more

PCM-Based Photonic Memory Cells: Design-Space Exploration And Performance Comparisons
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A technical paper titled "Programmable phase change materials and silicon photonics co-integration for photonic memory applications: a systematic study" was published by researchers at Colorado State University, CEA-LETI, and UC Berkeley. Find the technical paper here. August 2024. "We delve into the performance comparison of PCM-based programmable photonic memory cells based on silicon p... » read more

New Approach to Encoding Optical Weights for In-Memory Photonic Computing Using Magneto-Optic Memory Cells
By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A new technical paper titled "Integrated non-reciprocal magneto-optics with ultra-high endurance for photonic in-memory computing" was published by researchers at UC Santa Barbara, University of Cagliari, University of Pittsburgh, AIST and Tokyo Institute of Technology. Abstract "Processing information in the optical domain promises advantages in both speed and energy efficiency over existi... » read more

Mini Review of Photodetectors and Image Sensors: Materials and Fabrication
By Technical Paper Link - 19 Oct, 2024 - Comments: 0

A new technical paper titled "Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed Semiconductors" was published by researchers at Cardiff University. Abstract "This mini-review explores the evolution of image sensors, essential electronic components increasingly integrated into daily life. Traditional manufacturing methods for image sensors and photodetectors, ... » read more

Chiplet-Level HI of Polymer-Based Circuits For Fabricating Flexible Electronic-Photonic Integrated Devices
By Technical Paper Link - 09 Oct, 2024 - Comments: 0

A technical paper titled "Flexible electronic-photonic 3D integration from ultrathin polymer chiplets" was published by researchers at Dartmouth College and Boston University. The paper states: "Here, we present a robust chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where ultrathin polymer electronic and optoelectronic chiplets are vertically bonded at room tempe... » read more

Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
By Technical Paper Link - 26 Sep, 2024 - Comments: 0

A new technical paper titled "Using both faces of polar semiconductor wafers for functional devices" was published by researchers at Cornell University and Polish Academy of Sciences. Find the technical paper here. Published September 2024. Cornell University's news release is here, stating "Cornell researchers, in collaboration with a team at the Polish Academy of Sciences, have develope... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)
By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

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