category: Technical Papers

category: IoT, Security & Automotive

In-Depth Study of Low-Power MCUs For Wearables (EPFL)
By Technical Paper Link - 28 Dec, 2024 - Comments: 0

A new technical paper titled "Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical Applications" was published by researchers at EPFL. Abstract "Breakthroughs in ultra-low-power chip technology are transforming biomedical wearables, making it possible to monitor patients in real time with devices operating on mere {\mu}W. Although many studies have examined... » read more

Co-Packaged Optics To Train/Run GenAI Models in Data Centers (IBM)
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications" was published by researchers at IBM. Abstract "We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transf... » read more

Ammonia Plasma Surface Treatment for Improved Cu–Cu Bonding Reliability
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection" was published by researchers at Myongji University. Abstract "With the emergence of 3D stacked semiconductor products, such as high-bandwidth memory, bonding-interface reliability cannot be overemphasized. The condition of the surface interface befo... » read more

Wafer Bin Map Defect Classification Using Semi-Supervised Learning
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Semi-Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification" was published by researchers at Korea University. Abstract "Semi-supervised learning (SSL) models, which leverage both labeled and unlabeled datasets, have been increasingly applied to classify wafer bin map patterns in semiconductor manufacturing. These models typical... » read more

CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)
By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors" was published by researchers at Micron and Intel. Abstract "High-Performance Computing (HPC) and Artificial Intelligence (AI) workloads typically demand substantial memory bandwidth and, to a degree, memory capacity. CXL memory expansion modules, also known... » read more

Fully Partitioned Security Monitoring Logic From Both The CPU’s Main Core and Privileged SW (KAIST)
By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Interstellar: Fully Partitioned and Efficient Security Monitoring Hardware Near a Processor Core for Protecting Systems against Attacks on Privileged Software" was published by researchers at KAIST. The paper states "The existing approaches to instruction trace-based security monitoring hardware are dependent on the privileged software, which presents a signific... » read more

Nonvolatile Electrochemical Memory Cell For Temperatures Up To 600°C (U. Of Michigan, Sandia)
By Technical Paper Link - 18 Dec, 2024 - Comments: 0

A new technical paper titled "Nonvolatile electrochemical memory at 600°C enabled by composition phase separation" was published by researchers at University of Michigan and Sandia National Laboratories. "Moore’s law has led to monumental advances in computing over the past 50 years. However, one shortcoming of silicon-based logic and memory devices is their limited temperature range, typ... » read more

Promising Materials Beyond Silicon (TI, AIXTRON, imec)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "Future materials for beyond Si integrated circuits: a Perspective" was published by researchers at Texas Instruments, AIXTRON SE and imec. Abstract: "The integration of novel materials has been pivotal in advancing Si-based devices ever since Si became the preferred material for transistors, and later, integrated circuits. New materials have rapidly been adopte... » read more

98 Hardware Security Failure Scenarios (NIST)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "Hardware Security Failure Scenarios: Potential Hardware Weaknesses" was published by NIST. Abstract "Hardware is often assumed to be robust from a security perspective. However, chips are both created with software and contain complex encodings (e.g., circuit designs and firmware). This leads to bugs, some of which compromise security. This publication evaluate... » read more

Manipulating Diamond Surface Chemistry By UV Laser Etching (Macquarie Univ., MIT)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical titled "The effects of sub-monolayer laser etching on the chemical and electrical properties of the (100) diamond surface" was published by researchers at Macquarie University and MIT. Abstract "Tailoring the surface chemistry of diamond is critical to a range of applications from quantum science to electronics. It has been recently shown that dosing the diamond surface with... » read more

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