category: Technical Papers

category: IoT, Security & Automotive

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)
By Technical Paper Link - 24 Feb, 2025 - Comments: 0

A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

Cradle-To-Grave Analysis Of The Carbon Footprint of AI Hardware (Google)
By Technical Paper Link - 24 Feb, 2025 - Comments: 0

A new technical paper titled "Life-Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends" was published by researchers at Google. Abstract "Specialized hardware accelerators aid the rapid advancement of artificial intelligence (AI), and their efficiency impacts AI's environmental sustainability. This study presents the first publication of a comprehensive AI acc... » read more

Low-Cost TSV Repair Architecture Specialized for Highly Clustered TSV Faults Within HBM
By Technical Paper Link - 20 Feb, 2025 - Comments: 0

A new technical paper titled "Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults" was published by researchers at Yonsei University. Abstract "Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the entire chips. H... » read more

Material Properties of Si/SiGe Multi-layer Stacks For CFETs (Imec, Ghent U, et al.)
By Technical Paper Link - 19 Feb, 2025 - Comments: 0

A new technical paper titled "Epitaxial Si/SiGe Multi-Stacks: From Stacked Nano-Sheet to Fork-Sheet and CFET Devices" was published by researchers at Imec and Ghent University, et al. Abstract "After a short description of the evolution of metal-oxide-semiconductor device architectures and the corresponding requirements on epitaxial growth processes, the manuscript describes the material pr... » read more

CFETs with Optimized Buried Power Rails
By Technical Paper Link - 19 Feb, 2025 - Comments: 0

A technical paper titled "Buried power rail to suppress substrate leakage in complementary field effect transistor (CFET)" was published by researchers at Korea University and Sungkyunkwan University. Abstract "In the pursuit of minimizing the track height in standard cell, a design innovation incorporating complementary field-effect transistors (CFETs) and Buried Power Rail (BPR) technolog... » read more

Low-Temperature Solid-Liquid Interdiffusion Bonding For High-Density Interconnect Applications
By Technical Paper Link - 19 Feb, 2025 - Comments: 0

A new technical paper titled "Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding" was published by researchers at Aalto University in Finland. Abstract "The trend for 3D heterogeneous integration drives the need for a low-temperature bonding process for high-density interconnects (HDI). The Cu-Sn-In based solid-liquid interdiffusion (SLID) is a p... » read more

Temporal Variation in DRAM Read Disturbance in DDR4 and HBM2 (ETH Zurich, Rutgers)
By Technical Paper Link - 19 Feb, 2025 - Comments: 0

A new technical paper titled "Variable Read Disturbance: An Experimental Analysis of Temporal Variation in DRAM Read Disturbance" was published by researchers at ETH Zurich and Rutgers University. Abstract "Modern DRAM chips are subject to read disturbance errors. State-of-the-art read disturbance mitigations rely on accurate and exhaustive characterization of the read disturbance threshold... » read more

HW-Aligned Sparse Attention Architecture For Efficient Long-Context Modeling (DeepSeek et al.)
By Technical Paper Link - 18 Feb, 2025 - Comments: 0

A new technical paper titled "Native Sparse Attention: Hardware-Aligned and Natively Trainable Sparse Attention" was published by DeepSeek, Peking University and University of Washington. Abstract "Long-context modeling is crucial for next-generation language models, yet the high computational cost of standard attention mechanisms poses significant computational challenges. Sparse attention... » read more

Modeling and Simulation of NVM Technologies: Tutorial (TU Dormand, TU Dresden, KIT, FAU)
By Technical Paper Link - 17 Feb, 2025 - Comments: 0

A new technical paper titled "Modeling and Simulating Emerging Memory Technologies: A Tutorial" was published by researchers at TU Dortmund, TU Dresden, Karlsruhe Institute of Technology (KIT) and FAU ErlangenNürnberg. "This tutorial presents a simulation toolchain through four detailed case studies, showcasing its applicability to various domains of system design, including hybrid main-mem... » read more

FOWLP Warpage: Review Of Causes, Modeling And Methodologies For Controlling
By Technical Paper Link - 14 Feb, 2025 - Comments: 0

A new technical paper titled "Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies" was published by researchers at Arizona State University. Abstract "Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through i... » read more

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