category: Technical Papers

category: IoT, Security & Automotive

Hardware Security: Assessment Method For Attacks Using Real-World Cases (TU Wien, TÜV Austria)
By Technical Paper Link - 23 Apr, 2025 - Comments: 0

A new technical paper titled "The Pains of Hardware Security: An Assessment Model of Real-World Hardware Security Attacks" was published by researchers at TU Wien and TÜV Austria. "We review some of the publicly known HW attacks that have occurred and propose an assessment scheme for the attacks and the defense on hardware," states the paper. Find the technical paper here. April 2025. ... » read more

HW-based Heterogeneous Memory Management for LLM Inferencing (KAIST, Stanford Unversity)
By Technical Paper Link - 22 Apr, 2025 - Comments: 0

A new technical paper titled "Hardware-based Heterogeneous Memory Management for Large Language Model Inference" was published by researchers at KAIST and Stanford University. Abstract "A large language model (LLM) is one of the most important emerging machine learning applications nowadays. However, due to its huge model size and runtime increase of the memory footprint, LLM inferences suf... » read more

Single Transistor Memory Cell C2RAM Based On FDSOI For Quantum And Neuromorphic
By Technical Paper Link - 15 Apr, 2025 - Comments: 0

A new technical paper titled "An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures" was published by researchers at Forschungszentrum Jülich, RWTH Aachen University and SOITEC. Abstract: "Efficient computing in cryogenic environments, including classical von Neumann, quantum, and neuromorphic systems, is poised to transform big data processing. The que... » read more

Board-Level Packaging Method For Device Encapsulation To Enable Water Immersion Cooling
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling" was published by researchers at University of Illinois, Urbana, University of Arkansas and UC Berkeley. Abstract "Power densification is making thermal design a key step in the development of future electrical devices. Systems such as data centers and electric vehicl... » read more

ReRAM-Based, In-Memory Implementation Of Stochastic Computing
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "All-in-Memory Stochastic Computing using ReRAM" was published by researchers at TU Dresden, Center for Scalable Data Analytics and Artificial Intelligence (ScaDS.AI), Case Western Reserve University, University of Louisiana at Lafayette and Barkhausen Institut. Abstract "As the demand for efficient, low-power computing in embedded and edge devices grows, tradit... » read more

Pre-Silicon Hardware Trojans: Design, Benchmarking, Detection And Prevention (Sandia Labs)
By Technical Paper Link - 09 Apr, 2025 - Comments: 0

A new technical paper titled "A Survey on the Design, Detection, and Prevention of Pre-Silicon Hardware Trojans" was published by researchers at Sandia National Laboratories. "In this survey, we first highlight efforts in Trojan design and benchmarking, followed by a cataloging of seminal and recent works in Trojan detection and prevention and their accompanied metrics. Given the volume of l... » read more

GenAI for Analog IC Design (McMaster University)
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "Generative AI for Analog Integrated Circuit Design: Methodologies and Applications" was published by researchers at McMaster University. Abstract "Electronic Design Automation (EDA) in analog Integrated Circuits (ICs) has been the focus of extensive research; however, unlike its digital counterpart, it has not achieved widespread adoption. In this systematic re... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Cache Coherence In Network On Chip Design (NTU)
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "Learning Cache Coherence Traffic for NoC Routing Design" was published by researchers at Nanyang Technological University. "In this work, we propose a cache coherence-aware routing approach with integrated topology selection, guided by our Cache Coherence Traffic Analyzer (CCTA). Our method achieves up to 10.52% lower packet latency, 55.51% faster execution time... » read more

Countermeasure Against Confidentiality And Integrity Attacks On Hardware IP (U. of Florida)
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "HIPR: Hardware IP Protection through Low-Overhead Fine-Grain Redaction" was published by researchers at University of Florida. Abstract "Hardware IP blocks have been subjected to various forms of confidentiality and integrity attacks in recent years due to the globalization of the semiconductor industry. System-on-chip (SoC) designers are now considering a zero... » read more

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