category: Power & Performance

category: IoT, Security & Automotive

Distributed Shared Memory That Enlarges Effective Memory Capacity Through Intelligent Tiered DRAM and Storage Management (IIT)
By Technical Paper Link - 13 Nov, 2024 - Comments: 0

A new technical paper titled "MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads" was published by researchers at Illinois Institute of Technology. "In this work, we propose MegaMmap: a software distributed shared memory (DSM) that enlarges effective memory capacity through intelligent tiered DRAM and storage management. MegaMmap provides workload-aware d... » read more

Dedicated 3D Accelerator Specifically Designed For Emerging Spiking Transformers
By Technical Paper Link - 13 Nov, 2024 - Comments: 0

A new technical paper titled "Spiking Transformer Hardware Accelerators in 3D Integration" was published by researchers at UC Santa Barbara, Georgia Tech and Burapha University. "Recognizing the current lack of dedicated hardware support for spiking transformers, this paper presents the first work on 3D spiking transformer hardware architecture and design methodology. We present an architect... » read more

Improving Power and Speed in GAA-NS FETs
By Technical Paper Link - 11 Nov, 2024 - Comments: 0

A new technical paper titled "Design Decoupling of Inner-and Outer-Gate Lengths in Nanosheet FETs for Ultimate Scaling" was published by researchers at Belgium Research Center, Huawei Technologies and Global TCAD Solutions. Abstract: "Using a full design-technology-co-optimization (DTCO) methodology, we show the advantages of design decoupling of inner -and outer-gates in gate-all-around ... » read more

New Class Of Materials With Increased Band Gap (U. of Minnesota, Caltech)
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Deep-ultraviolet transparent conducting SrSnO3 via heterostructure design" was published by researchers at University of Minnesota–Twin Cities and Caltech. The researchers "looked at creating a new class of materials with increased “band gap,” enhancing both transparency and conductivity. The new material is a transparent conducting oxide, created with a s... » read more

Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically" was published by researchers at University of Cambridge and GlitterinTech Limited. Abstract "Silicon photonic switches are widely considered as a cost-effective solution for addressing the ever-growing data traffic in datacenter networks, as they offer unique advantages such as low power co... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Formally Modeling and Verifying CXL Cache Coherence (Imperial College London)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Formalising CXL Cache Coherence" was published by researchers at Imperial College London. Abstract "We report our experience formally modelling and verifying CXL.cache, the inter-device cache coherence protocol of the Compute Express Link standard. We have used the Isabelle proof assistant to create a formal model for CXL.cache based on the prose English spec... » read more

Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs" was published by researchers at Cornell University. "In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated th... » read more

Physics-Based Efficient Device Model for Fe-TFTs (Univ. of Florida)
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "An efficient device model for ferroelectric thin-film transistors" was published by researchers at University of Florida. Abstract "Ferroelectric thin-film transistors (Fe-TFTs) have promising potential for flexible electronics, memory, and neuromorphic computing applications. Here, we report on a physics-based efficient device model for Fe-TFTs that effectivel... » read more

3D Device With BEOL-Compatible Channel And Physical Design for Efficient Double-Side Routing
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Omni 3D: BEOL-Compatible 3D Logic with Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation, and Carnegie Mellon University. Abstract "This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves ... » read more

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