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Wafer Scale Transfer of 2D Materials, Graphene


A new technical paper titled "Assessment of Wafer-Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements" was published by researchers at Infineon Technologies AG, RWTH Aachen University, Protemics, and Advantest. Abstract "Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requ... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies


A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

Flexible In-Field Test of a CAN Controller


A technical paper titled "A Systematic Method to Generate Effective STLs for the In-Field Test of CAN Bus Controllers" was published by Delft University of Technology, Cadence, and Politecnico di Torino. Abstract "In order to match the strict reliability requirements mandated by regulations and standards adopted in the automotive sector, as well as other domains where safety is a major conc... » read more

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices


A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more

Using BDA To to Predict SAQP Pitch Walk


A new technical paper titled "Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning" was published by researchers at IBM TJ Watson Research Center and Rensselaer Polytechnic Institute. Find the technical paper here. Published November 2022.  Open Access. Scott D. Halle, Derren N. Dunn, Allen H. Gabor, Max O. Bloomfield, and Mark Sh... » read more

Active Learning to Reduce Data Requirements For Defect Identification in Semiconductor Manufacturing


A new technical paper titled "Exploring Active Learning for Semiconductor Defect Segmentation" was published by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore. "We identify two unique challenges when applying AL on semiconductor XRM scans: large domain shift and severe class-imbalance. To address these challenges, we propose to perform contrastive pretrainin... » read more

Visual Fault Inspection Using A Hybrid System Of Stacked DNNs


A technical paper titled "Improving automated visual fault inspection for semiconductor manufacturing using a hybrid multistage system of deep neural networks" was published by researchers at Chemnitz University of Technology (Germany). According to the paper, "this contribution introduces a novel hybrid multistage system of stacked deep neural networks (SH-DNN) which allows the localization... » read more

Robust Latch Hardened Against QNUs for Safety-Critical Applications in 22nm CMOS Technology


A technical paper titled "Cost-Optimized and Robust Latch Hardened against Quadruple Node Upsets for Nanoscale CMOS" was just published by researchers at Anhui University, Hefei University of Technology, Anhui Polytechnic University, Kyushu Institute of Technology, and the University of Montpellier/CNRS. Abstract: "With the aggressive reduction of CMOS transistor feature sizes, the soft ... » read more

Identifying PCB Defects with a Deep Learning Single-Step Detection Model


This new technical paper titled "End-to-end deep learning framework for printed circuit board manufacturing defect classification" is from researchers at École de technologie supérieure (ÉTS) in Montreal, Quebec. Abstract "We report a complete deep-learning framework using a single-step object detection model in order to quickly and accurately detect and classify the types of manufacturi... » read more

Publicly Available Dataset for PCB X-Ray Inspection (FICS- University of Florida)


Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled "FICS PCB X-ray: A dataset for automated printed circuit board inter-layers inspection." Abstract "Advancements in computer vision and machine learning breakthroughs over the years have paved the way for automated X-ray inspection (AXI) of printed circuit bo... » read more

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