category: Test, Measurement & Analytics

category: IoT, Security & Automotive

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

LLMs For Hardware Design Verification
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “LLM4DV: Using Large Language Models for Hardware Test Stimuli Generation” was published by researchers at University of Cambridge, lowRISC, and Imperial College London. Abstract: "Test stimuli generation has been a crucial but labor-intensive task in hardware design verification. In this paper, we revolutionize this process by harnessing the power of large langua... » read more

Industry 4.0 Paradigms For Chip Workforce Development And Domestic Production: Using Automation And AR/VR
By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production” was published by researchers at University of Florida Gainesville, ZEISS Microscopy, and US Partnership for Assured Electronics (USPAE). Abstract: "The CHIPS Act is driving the U.S. towards a self-sustainable f... » read more

A Practical DRAM-Based Multi-Level PIM Architecture For Data Analytics
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "Darwin: A DRAM-based Multi-level Processing-in-Memory Architecture for Data Analytics" was published by researchers at Korea Advanced Institute of Science & Technology (KAIST) and SK hynix Inc. Abstract: "Processing-in-memory (PIM) architecture is an inherent match for data analytics application, but we observe major challenges to address when accelerating it usi... » read more

A 3D MEMS Coaxial Socket Overcomes Challenges In Semiconductor Package Chip Testing
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing" was published by researchers at Yonsei University and Protec MEMS Technology. Abstract: "With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions tha... » read more

An Efficient Method To Develop, Evaluate, and Demonstrate Connected And Autonomous Driving 
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Vehicle-in-Virtual-Environment (VVE) Method for Autonomous Driving System Development, Evaluation and Demonstration" was published by researchers at Ohio State University. Abstract: "The current approach to connected and autonomous driving function development and evaluation uses model-in-the-loop simulation, hardware-in-the-loop simulation and limited proving ground... » read more

Fault Awareness And Reliability Improvements In a Fault-Tolerant RISC-V SoC (HARV-SoC)
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Enhancing Fault Awareness and Reliability of a Fault-Tolerant RISC-V System-on-Chip” was published by researchers at University of Montpellier and University of Vale do Itajaí. Abstract: "Recent research has shown interest in adopting the RISC-V processors for high-reliability electronics, such as aerospace applications. The openness of this architecture enables... » read more

Multi-Rate Discrete-Time Modeling Approach Of A Power Hardware-in-the-Loop Setup (Karlsruhe Institute of Technology)
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Multi-rate Discrete Domain Modeling of Power Hardware-in-the-Loop Setups” was published by researchers at the Institute for Technical Physics, Karlsruhe Institute of Technology, Karlsruhe, Germany. Abstract: "Power Hardware-in-the-Loop (PHIL) facilitates the testing of novel power engineering solutions in the lab, allowing a flexible testing environment while kee... » read more

3D Memory Structures: Common Hole And Tilt Metrology Techniques and Capabilities
By Technical Paper Link - 03 Jun, 2023 - Comments: 0

A technical paper titled "Inline metrology of high aspect ratio hole tilt and center line shift using small-angle x-ray scattering" was published by researchers at Bruker Nano and Lam Research. Abstract: "High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep... » read more

Latest Discoveries in the Mechanics of 2D Materials
By Technical Paper Link - 31 May, 2023 - Comments: 0

A new technical paper titled "Recent advances in the mechanics of 2D materials" was published by researchers at McGill University, University of Science and Technology of China, and University of Illinois. "We review significant advances in the understanding of the elastic properties, in-plane failures, fatigue performance, interfacial shear/friction, and adhesion behavior of 2D materials. I... » read more

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