category: Test, Measurement & Analytics

category: IoT, Security & Automotive

Latest Discoveries in the Mechanics of 2D Materials
By Technical Paper Link - 31 May, 2023 - Comments: 0

A new technical paper titled "Recent advances in the mechanics of 2D materials" was published by researchers at McGill University, University of Science and Technology of China, and University of Illinois. "We review significant advances in the understanding of the elastic properties, in-plane failures, fatigue performance, interfacial shear/friction, and adhesion behavior of 2D materials. I... » read more

CDSAXS Milestones And Future Growth of X-ray-Based Metrology for 3D Nanostructures Important To Chip Industry
By Technical Paper Link - 20 Apr, 2023 - Comments: 0

A new technical paper titled "Review of the key milestones in the development of critical dimension small angle x-ray scattering at National Institute of Standards and Technology." Abstract: "An x-ray scattering based metrology was conceived over 20 years ago as part of a collaboration between National Institute of Standards and Technology (NIST) and International Business Machines Corporat... » read more

More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering" was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. Abstract: "In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by ima... » read more

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

Automotive MCUs: Digital Twin of the LBIST Functionality
By Technical Paper Link - 15 Feb, 2023 - Comments: 0

A new technical paper titled "A Novel LBIST Signature Computation Method for Automotive Microcontrollers using a Digital Twin" was written by researchers at Infineon Technologies, University of Bremen, and DFKI GmbH. Abstract "LBIST has been proven to be an effective measure for reaching functional safety goals for automotive microcontrollers. Due to a large variety of recent innovative fea... » read more

Detecting Hardware Trojans In a RISC-V Core’s Post-Layout Phase
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper "Trojan-D2: Post-Layout Design and Detection of Stealthy Hardware Trojans - A RISC-V Case Study" was published by researchers at University of Bremen, DFKI GmbH, and the German Aerospace Center. Abstract: "With the exponential increase in the popularity of the RISC-V ecosystem, the security of this platform must be re-evaluated especially for mission-critical and IoT d... » read more

Wafer Scale Transfer of 2D Materials, Graphene
By Technical Paper Link - 29 Jan, 2023 - Comments: 0

A new technical paper titled "Assessment of Wafer-Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements" was published by researchers at Infineon Technologies AG, RWTH Aachen University, Protemics, and Advantest. Abstract "Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requ... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies
By Technical Paper Link - 11 Jan, 2023 - Comments: 0

A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

Flexible In-Field Test of a CAN Controller
By Technical Paper Link - 06 Jan, 2023 - Comments: 0

A technical paper titled "A Systematic Method to Generate Effective STLs for the In-Field Test of CAN Bus Controllers" was published by Delft University of Technology, Cadence, and Politecnico di Torino. Abstract "In order to match the strict reliability requirements mandated by regulations and standards adopted in the automotive sector, as well as other domains where safety is a major conc... » read more

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more

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