category: Test, Measurement & Analytics

category: IoT, Security & Automotive

Fault Awareness And Reliability Improvements In a Fault-Tolerant RISC-V SoC (HARV-SoC)
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Enhancing Fault Awareness and Reliability of a Fault-Tolerant RISC-V System-on-Chip” was published by researchers at University of Montpellier and University of Vale do Itajaí. Abstract: "Recent research has shown interest in adopting the RISC-V processors for high-reliability electronics, such as aerospace applications. The openness of this architecture enables... » read more

Multi-Rate Discrete-Time Modeling Approach Of A Power Hardware-in-the-Loop Setup (Karlsruhe Institute of Technology)
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Multi-rate Discrete Domain Modeling of Power Hardware-in-the-Loop Setups” was published by researchers at the Institute for Technical Physics, Karlsruhe Institute of Technology, Karlsruhe, Germany. Abstract: "Power Hardware-in-the-Loop (PHIL) facilitates the testing of novel power engineering solutions in the lab, allowing a flexible testing environment while kee... » read more

3D Memory Structures: Common Hole And Tilt Metrology Techniques and Capabilities
By Technical Paper Link - 03 Jun, 2023 - Comments: 0

A technical paper titled "Inline metrology of high aspect ratio hole tilt and center line shift using small-angle x-ray scattering" was published by researchers at Bruker Nano and Lam Research. Abstract: "High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep... » read more

Latest Discoveries in the Mechanics of 2D Materials
By Technical Paper Link - 31 May, 2023 - Comments: 0

A new technical paper titled "Recent advances in the mechanics of 2D materials" was published by researchers at McGill University, University of Science and Technology of China, and University of Illinois. "We review significant advances in the understanding of the elastic properties, in-plane failures, fatigue performance, interfacial shear/friction, and adhesion behavior of 2D materials. I... » read more

CDSAXS Milestones And Future Growth of X-ray-Based Metrology for 3D Nanostructures Important To Chip Industry
By Technical Paper Link - 20 Apr, 2023 - Comments: 0

A new technical paper titled "Review of the key milestones in the development of critical dimension small angle x-ray scattering at National Institute of Standards and Technology." Abstract: "An x-ray scattering based metrology was conceived over 20 years ago as part of a collaboration between National Institute of Standards and Technology (NIST) and International Business Machines Corporat... » read more

More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering" was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. Abstract: "In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by ima... » read more

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

Automotive MCUs: Digital Twin of the LBIST Functionality
By Technical Paper Link - 15 Feb, 2023 - Comments: 0

A new technical paper titled "A Novel LBIST Signature Computation Method for Automotive Microcontrollers using a Digital Twin" was written by researchers at Infineon Technologies, University of Bremen, and DFKI GmbH. Abstract "LBIST has been proven to be an effective measure for reaching functional safety goals for automotive microcontrollers. Due to a large variety of recent innovative fea... » read more

Detecting Hardware Trojans In a RISC-V Core’s Post-Layout Phase
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper "Trojan-D2: Post-Layout Design and Detection of Stealthy Hardware Trojans - A RISC-V Case Study" was published by researchers at University of Bremen, DFKI GmbH, and the German Aerospace Center. Abstract: "With the exponential increase in the popularity of the RISC-V ecosystem, the security of this platform must be re-evaluated especially for mission-critical and IoT d... » read more

Wafer Scale Transfer of 2D Materials, Graphene
By Technical Paper Link - 29 Jan, 2023 - Comments: 0

A new technical paper titled "Assessment of Wafer-Level Transfer Techniques of Graphene with Respect to Semiconductor Industry Requirements" was published by researchers at Infineon Technologies AG, RWTH Aachen University, Protemics, and Advantest. Abstract "Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requ... » read more

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