category: Top Stories

category: Auto, Security & Edge AI

When Can I Buy A Chiplet?
By Brian Bailey - 17 Jul, 2025 - Comments: 1

One year ago, Semiconductor Engineering conducted its first roundtable to find out the true state of the industry for chiplets. At that event, it was stated that no chiplet had ever been reused in a design for which it was not initially intended. How much has changed over the past year? Returning from last year were Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice... » read more

RISC-V’s Increasing Influence
By Brian Bailey - 12 Jun, 2025 - Comments: 2

The industry is increasingly talking about benefits brought by the RISC-V architecture, but is it even the right starting point? While it may not be perfect, it may provide the flexibility necessary to move forward gradually. Computer architectures and software have followed in the footsteps of processors developed 80 years ago. They aimed to solve sequential, scalar arithmetic problems usin... » read more

Multi-Die Assemblies Complicate Parasitic Extraction
By Ann Mutschler - 12 Jun, 2025 - Comments: 0

The shift from planar designs to multi-die assemblies with complex interconnects is transforming what had become almost an afterthought in the design process into a first-order challenge. Parasitics include things like inductance, capacitance, and resistance, which have become more problematic at advanced nodes due to increasing logic density, thinner interconnects and insulators, and a spik... » read more

The Best DRAMs For Artificial Intelligence
By Bryon Moyer - 12 Jun, 2025 - Comments: 0

Artificial intelligence (AI) involves intense computing and tons of data. The computing may be performed by CPUs, GPUs, or dedicated accelerators, and while the data travels through DRAM on its way to the processor, the best DRAM type for this purpose depends on the type of system that is performing the training or inference. The memory challenge facing engineering teams today is how to keep... » read more

Connecting AI Accelerators
By Ann Mutschler - 04 Jun, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering sat down to discuss the various ways that AI accelerators are being applied today with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; Alexander Petr, senior director at Keysight; Steve Roddy, chief marketing office... » read more

Future-proofing AI Models
By Ann Mutschler - 21 May, 2025 - Comments: 0

Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to discuss the challenges of future-proofing these designs with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vic... » read more

Die-to-die Interconnect Standards In Flux
By Bryon Moyer - 15 May, 2025 - Comments: 0

UCIe, a standard for die-to-die interconnect in advanced packages, has drawn concern about being too heavyweight with its 2.0 release. But the fact that many of the new features are optional seems to have been lost in much of the public discussion. In fact, new capabilities that support a possible future chiplet marketplace are not required for designs that don’t target that marketplace. ... » read more

Development Flows For Chiplets
By Brian Bailey - 15 May, 2025 - Comments: 2

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has to come together before that becomes reality. It takes an ecosystem, which is currently very rudimentary. Today, many companies have hit the reticle limit and are forced to move to multi-die solutions, but that does not create a plug-and-play chiplet market. These ear... » read more

AI Accelerators Moving Out From Data Centers
By Ann Mutschler - 15 May, 2025 - Comments: 0

Experts At The Table: The explosion in AI data is driving chipmakers to look beyond a single planar SoC. Semiconductor Engineering sat down to discuss the need for more computing and the expanding role of chiplets with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; ... » read more

Chiplet Tradeoffs And Limitations
By Ann Mutschler - 10 Apr, 2025 - Comments: 0

The semiconductor industry is buzzing with the benefits of chiplets, including faster time to market, better performance, and lower power, but finding the correct balance between customization and standardization is proving to be more difficult than initially thought. For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave indiv... » read more

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