Ruthenium Interconnects On Tap

By Katherine Derbyshire - 20 Jun, 2024 - Comments: 0

Chipmakers' focus on new interconnect technology is ramping up as copper's effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat at future nodes and in advanced packages. The introduction of copper interconnects in 1997 upended the then-standard tungsten via/aluminum line metallization scheme. Dual damascene integration ... » read more

Opportunities Grow For GPU Acceleration

By Gregory Haley - 05 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. W... » read more

Integration Hurdles For Analog And RF In Next-Gen Packages

By Gregory Haley - 23 May, 2024 - Comments: 0

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Reducing Risk In The Semiconductor Supply Chain

By Laura Peters - 23 May, 2024 - Comments: 0

Companies that were hit with chip shortages during the pandemic are changing their strategies to prevent future problems, deploying a combination of supply chain mapping, second sourcing, and digital transformation. Those shortages caused a $200 billion loss for automotive manufacturers, and the disruptions were far more widespread, in many cases lasting for years. Companies of all sorts wer... » read more

Sidestepping Lithography In Chip Manufacturing

By Katherine Derbyshire - 23 May, 2024 - Comments: 0

Rising lithography costs, shrinking feature sizes, and the need for an alternative to copper are collectively spurring new interest in area-selective deposition. An extension of atomic layer deposition, ASD seeks to build circuit features from the bottom up, without relying on lithography. Lithography will remain a critical tool for the foreseeable future. But it has long been the most expen... » read more

Veterans Could Close The Semi Industry’s Workforce Gap

By Liz Allan - 22 May, 2024 - Comments: 0

Veterans are beginning to form a valuable talent pool for advanced manufacturing and chip-sector positions, helping to fill the current and projected future gap in qualified workers as new fabs come online, and adding discipline and skills that are difficult to find otherwise. The job opportunities are many, and so are the possible job paths. In some cases, veterans are looking to make a qui... » read more

Navigating The GPU Revolution

By Gregory Haley - 24 Apr, 2024 - Comments: 0

Predicting And Preventing Process Drift

By Gregory Haley - 22 Apr, 2024 - Comments: 0

Increasingly tight tolerances and rigorous demands for quality are forcing chipmakers and equipment manufacturers to ferret out minor process variances, which can create significant anomalies in device behavior and render a device non-functional. In the past, many of these variances were ignored. But for a growing number of applications, that's no longer possible. Even minor fluctuations in ... » read more

Electromigration Concerns Grow In Advanced Packages

By Laura Peters - 18 Apr, 2024 - Comments: 0

The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is well understood, it's becoming more difficult to contain in leading-edge designs. Of particular concern is electromigration, which is becoming more troublesome in advanced packages with multiple ch... » read more

What Works Best For Chiplets

By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

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Knowledge Centers
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