category: Top Stories

category: IoT, Security & Automotive

Shift Left, Extend Right, Stretch Sideways
By Brian Bailey - 27 Jul, 2023 - Comments: 0

The EDA industry has been talking about shift left for a few years, but development flows are now being stretched in two additional ways, extending right to include silicon lifecycle management, and sideways to include safety and security. In addition, safety and security join verification and power as being vertical concerns, and we are increasingly seeing interlinking within those concerns. ... » read more

The Good And Bad Of Chip Design On Cloud
By Ann Mutschler - 27 Jul, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about how the shift toward chip design on cloud has sped up, whether the benefits of cloud are realized in chip design, and some of the most pressing challenges to chip design on cloud today, with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Syst... » read more

Large-Scale Integration’s Future Depends On Modeling
By Karen Heyman - 27 Jul, 2023 - Comments: 0

VLSI is a term that conjures up images of a college textbook, but some of the concepts included in very large-scale integration remain relevant and continue to evolve, while others have fallen by the wayside. The portion of VLSI that remains most relevant for semiconductor industry is "integration," which is pushing well beyond the edges of a monolithic planar chip. But that expansion also i... » read more

Startup Funding: June 2023
By Jesse Allen - 10 Jul, 2023 - Comments: 0

June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

Challenges Grow For Data Management And Sharing In EDA
By Ed Sperling - 29 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

Not All There: Heterogeneous Multiprocessor Design Tools
By Brian Bailey - 26 Jun, 2023 - Comments: 0

The design, implementation, and programming of multicore heterogeneous systems is becoming more common, often driven by the software workloads, but the tooling to help optimize the processors, interconnect, and memory are disjointed. Over the past few years, many tools have emerged that help with the definition and implementation of a single processor, optimized for a given set of software. ... » read more

The Uncertainties Of RISC-V Compliance
By Ann Mutschler - 22 Jun, 2023 - Comments: 0

How far can a RISC-V design be pushed and still be compliant? The answer isn't always black-and-white because the RISC-V concept is very different from previous open-source projects. But as interest and activity in RISC-V continues to grow, constructive discussions are taking place to address some of the challenges of designing with an open-standard ISA. “The RISC-V standard is somethin... » read more

Verification And Test Of Safety And Security
By Brian Bailey - 22 Jun, 2023 - Comments: 0

Functional verification can cost as much as design, but new capabilities are piling onto an already stressed verification methodology, leaving solutions fragmented and incomplete. In a perfect world, a semiconductor device would be verified to operate according to its complete specification, and continue to operate correctly over the course of its useful life. The reality, however, is this i... » read more

Better Choreography Required For Complex Chips
By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

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