category: Top Stories

category: IoT, Security & Automotive

Startup Funding: December 2022
By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Designing For Multiple Die
By Ann Mutschler - 21 Dec, 2022 - Comments: 1

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

RISC-V Pushes Into The Mainstream
By Ed Sperling - 21 Dec, 2022 - Comments: 1

RISC-V cores are beginning to show up in heterogeneous SoCs and packages, shifting from one-off standalone designs toward mainstream applications where they are used for everything from accelerators and extra processing cores to security applications. These changes are subtle but significant. They point to a growing acceptance that chips or chiplets based on an open-source instruction set ar... » read more

Adapting To Broad Shifts Essential In 2022
By Brian Bailey - 21 Dec, 2022 - Comments: 0

Change creates opportunity, but not every company is able to respond quickly enough to take advantage of those opportunities. Others may respond too quickly, before they properly understand the implications. At the start of a typical year, optimism is in plentiful supply. Any positive trend is seen as continuing, and any negative is seen as turning around. Normally the later in the year that... » read more

Improving Concurrent Chip Design, Manufacturing, And Test Flows
By Ann Mutschler - 28 Nov, 2022 - Comments: 0

Semiconductor design, manufacturing, and test are becoming much more tightly integrated as the chip industry seeks to optimize designs using fewer engineers, setting the stage for greater efficiencies and potentially lower chip costs without just relying on economies of scale. The glue between these various processes is data, and the chip industry is working to weave together various steps t... » read more

Is UCIe Really Universal?
By Brian Bailey - 22 Nov, 2022 - Comments: 3

Chiplets are rapidly becoming the means to overcome the slowing of Moore's Law, but whether one interface is capable of joining them all together isn't clear yet. The Universal Chiplet Interconnect Express (UCIe) believes it will work, but some in the industry remain unconvinced. At least part of the problem is that interconnect standards are never truly finished. Even today, the protocols tha... » read more

EDA Tools For Quantum Chips
By Marie C. Baca - 22 Nov, 2022 - Comments: 0

Commercially viable quantum computers are at least several years away, but some researchers already are questioning whether existing EDA tools will be sufficient for designing quantum chips and systems. That’s because quantum design requirements at times transcend classical rules about materials, temperature, and structure — rules that are foundational for the majority of EDA products on th... » read more

The Drive Toward Virtual Prototypes
By Brian Bailey - 22 Nov, 2022 - Comments: 1

Chipmakers are piling an increasing set of demands on virtual prototypes that go well beyond its original scope, forcing EDA companies to significantly rethink models, abstractions, interfaces, view orthogonality, and flows. The virtual prototype has been around for at least 20 years, but its role has been limited. It has largely been used as an integration and analysis platform for models t... » read more

Chip Design Shifts As Fundamental Laws Run Out Of Steam
By Ann Mutschler - 31 Oct, 2022 - Comments: 12

Dennard scaling is gone, Amdahl's Law is reaching its limit, and Moore's Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing. Rather than just different process nodes and half ... » read more

Raising IP Integration Up A Level
By Brian Bailey - 27 Oct, 2022 - Comments: 0

An increase in the number and complexity of IP blocks, coupled with changing architectures and design concerns, are driving up the need for new tools that can enable, automate, and optimize integration in advanced chips and packages. Power, security, verification and a host of other issues are cross-cutting concerns, and they make pure hierarchical approaches difficult. Adding to future comp... » read more

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