category: Top Stories

category: IoT, Security & Automotive

EDA On Cloud Presents Unique Challenges
By Ann Mutschler - 31 Mar, 2022 - Comments: 0

Discussions about cloud-based EDA tools are heating up for both hardware and software engineering projects, opening the door to vast compute resources that can be scaled up and down as needed. Still, not everyone is on board with this shift, and even companies that use the cloud don't necessarily want to use it for every aspect of chip design. But the number of cloud-based EDA tools is growi... » read more

Incremental Design Breakdown
By Brian Bailey - 24 Mar, 2022 - Comments: 0

For the past two decades, most designs have been incremental in nature. They heavily leveraged IP used in previous designs, and that IP often was developed by third parties. But there are growing problems with that methodology, especially at advanced nodes where back-end issues and the impact of 'shift left' are reducing the savings from reuse. The value of IP reuse has been well established... » read more

How To Justify A Data Center
By Ann Mutschler - 24 Mar, 2022 - Comments: 0

The breadth of cloud capabilities and improvements in cost and licensing structures is prompting chipmakers to consider offloading at least some of their design work into the cloud. Cloud is a viable business today for semiconductor design. Over the past decade, the interest in moving to cloud computing has grown from an idea that was fun to talk about — but which no one was serious about ... » read more

Planning EDA’s Next Steps
By Ed Sperling - 24 Mar, 2022 - Comments: 0

Anirudh Devgan, Cadence's new CEO, and the recipient of the Phil Kaufman Award in December, sat down with Semiconductor Engineering to talk about what's next in EDA, the underlying technology and business challenges and changes, and new markets that are unfolding for floor-planning, verification, CFD, and advanced packaging. SE: Where does EDA need to improve? Devgan: We have made it much... » read more

Preparing For Test Early In The Design Flow
By Ann Mutschler - 02 Mar, 2022 - Comments: 0

Until very recently, semiconductor design, verification, and test were separate domains. Those domains have since begun to merge, driven by rising demand for reliability, shorter market windows, and increasingly complex chip architectures. In the past, products were designed from a functional perspective, and designers were not concerned about what the physical implementation of the product ... » read more

Data Center Architectures In Flux
By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Why RISC-V Is Succeeding
By Brian Bailey - 24 Feb, 2022 - Comments: 5

There is no disputing the excitement surround the introduction of the RISC-V processor architecture. Yet while many have called it a harbinger of a much broader open-source hardware movement, the reasons behind its success are not obvious, and the implications for an expansion of more open-source cores is far from certain. “The adoption of RISC-V as the preferred architecture for many sili... » read more

Unintended Coupling Issues Grow
By Brian Bailey - 24 Feb, 2022 - Comments: 0

The number of indirect and often unexpected ways in which one design element may be affected by another is growing, making it more difficult to ensure a chip — or multiple chips in a package — will perform reliably. Long gone are the days when the only way that one part of a circuit could influence another was by an intended wire connecting them. As geometries get smaller, frequencies go... » read more

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Design Challenges Increasing For Mixed-Die Packages
By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

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