category: Top Stories

category: IoT, Security & Automotive

How Software-Defined Vehicles Change Auto Chip Design
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The shift to software-defined vehicles is changing nearly every aspect of automotive design, from what hardware is added into vehicles, when it gets added, and what gets left behind. Moving key features to software rather than hardware allows carmakers to bring new features to market faster, at a lower cost, and to modify those features more quickly. It is also expected to drive up the value... » read more

ISO 26262’s Importance Widens Beyond Automotive
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The ISO 26262 standard, which has become a mainstay since the trend toward vehicle electrification really took root a decade ago, is starting to gain traction in markets outside of automotive chip and system design. At the center of this expansion is a focus on safety under a variety of conditions — extreme temperatures, unexpected vibration, or a collision that is unavoidable. This includ... » read more

Startup Funding: Q4 2024
By Jesse Allen - 08 Jan, 2025 - Comments: 0

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 million in the largest round for a chip design startup this year. It was far from the only AI startup, however, as several companies gathered support for neuromorphic designs focused on ultra-low po... » read more

What’s Next For Through-Silicon Vias
By Laura Peters - 06 Jan, 2025 - Comments: 0

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias (TSVs) enable shorter interconnect lengths, which reduces chip power consumption and latency to carry signals faster from one device to another or within a device. Advanced packaging technology... » read more

Top Tech Videos Of 2024
By Liz Allan - 31 Dec, 2024 - Comments: 0

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, safety monitoring, security, and much more. Top 5 most watched videos in 2024: Overlay Optimization In Advanced IC Substrates How To Stop Row Hammer Attacks What’s Changing In DRAM ... » read more

Auto Ecosystem Begins Shift To Software-First
By Ann Mutschler - 30 Dec, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing levels of autonomy, electrification, and software-defined vehicle concepts. Semiconductor Engineering sat down to discuss these and other related issues with Wayne Lyons, senior director for the au... » read more

Semiconductor Engineering’s Special Reports 2024
By The SE Staff - 23 Dec, 2024 - Comments: 0

Semiconductor Engineering published 36 special reports in 2024. Focus Areas Manufacturing, Packaging, Materials Test, Measurement New Fabs and Funding Memory Design Power, Performance Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging  Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Comp... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches
By Ann Mutschler - 19 Dec, 2024 - Comments: 2

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Improving Verification Performance
By Brian Bailey - 19 Dec, 2024 - Comments: 0

Without methodology improvements, verification teams would not be able keep up with the growing complexity and breadth of the tasks assigned to them. Tools alone will not provide the answer. The magnitude of the verification task continues to outpace the tools, forcing design teams to seek out better ways to intermix and utilize the tools that are available. But as verification teams take on... » read more

SLM Evolves Into Critical Aspect Of Chip Design And Operation
By Ann Mutschler - 19 Dec, 2024 - Comments: 0

Silicon lifecycle management has evolved greatly in the past five years, moving from novel concept to a key part of design flows at industry leaders such as NVIDIA, Amazon Web Services, Ericsson, and others. Along with becoming a major focus for companies developing semiconductors, the use cases have expanded. While initially focused on post-silicon insights, SLM has expanded to cover the en... » read more

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