category: Top Stories

category: Auto, Security & Edge AI

Metrology Digs Deep To Produce Next-Generation 3D NAND
By Laura Peters - 09 Dec, 2025 - Comments: 1

Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions shrinking from 18 months to every 12 months, chipmakers are constantly innovating to enable this prodigious scaling pace. 3D NAND technology is a core ingredient in mobile phones, solid-state dr... » read more

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing
By Anne Meixner - 09 Dec, 2025 - Comments: 0

Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

Small Language Models Create New Security Risks
By Ed Sperling - 04 Dec, 2025 - Comments: 0

The rollout of edge AI is creating new security risks due to a mix of small language models (SLMs), their integration into increasingly complex hardware, and the behavior and interactions of both over time. AI data centers still garner the most attention due to massive investments and an ongoing flood of deals and acquisitions, but the edge is quietly starting to take shape for several reaso... » read more

Physical AI Takes Functional Safety Cues From Automotive
By Liz Allan - 04 Dec, 2025 - Comments: 0

Robots are becoming smarter, more capable, and more pervasive, setting the stage for a whole new round of growth that will touch nearly every part of the semiconductor and software industries for decades to come. Robots are at the core of physical AI, a broad segment of edge AI systems that interact with the world through artificial intelligence and sensors. This includes everything from hum... » read more

Harnessing Silicon Lifecycle Management For Chip Security
By Ann Mutschler - 04 Dec, 2025 - Comments: 0

Silicon lifecycle management is starting to be used in ways that extend well beyond its original mission of ensuring a chip functions to spec throughout its expected lifetime. While tracking aging effects and component failures are still important, the technology also is being deployed to proactively monitor, authenticate, and respond to potential threats in real-time. In fact, not applying ... » read more

Optimizing AI Workloads For Edge Computing
By Ann Mutschler - 03 Dec, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss how some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president an... » read more

3DKs: Making Headway On Chiplet Standards
By Laura Peters - 01 Dec, 2025 - Comments: 0

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon cycle is performed in-house. But the industry’s long-term goal of a free and open chiplet marketplace, in which companies of any size can reap the rewards and economies of scale associated with mult... » read more

AI Plays Multiple Roles Within EDA
By Brian Bailey - 25 Nov, 2025 - Comments: 0

AI's infusion into our world may seem sudden and unexpected, but EDA has been quietly adopting it for more than a decade. What's changed is that it's now becoming more visible, thanks to increasingly powerful large language models (LLMs) and the need to apply them to increasingly challenging multi-physics problems. Two fundamental shifts underlie AI's increasing prominence. First, heat is be... » read more

FPGAs Find New Workloads In The High-Speed AI Era
By Liz Allan - 25 Nov, 2025 - Comments: 0

FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. Field-programmable gate arrays (FPGAs) enable designers to reprogram or reconfigure digital logic after the chips have been deployed, which is essential in the AI world, wher... » read more

The Real-World Impact Of Silicon Lifecycle Management On Chip Architectures
By Ann Mutschler - 25 Nov, 2025 - Comments: 0

Silicon lifecycle management (SLM) is transforming chip architectures, empowering designers to build smarter, more resilient, and secure semiconductor devices by leveraging data from manufacturing to end of life in the field. That data can be used to improve future designs, reduce margin, and continuously optimize performance and power efficiency throughout a chip's lifetime. Moreover, under... » read more

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