category: Top Stories

category: Auto, Security & Edge AI

The Race Begins For Much Bigger Abstractions In Data Centers
By Ed Sperling - 17 Feb, 2026 - Comments: 0

Key Takeaways Data center build-out is enabling much larger and more complex abstractions. Competition is building for digital/virtual twins across multiple industry segments, including automotive, aerospace, and chip manufacturing. AI, and particularly AI agents, will play a significant role in sorting through data to find potential trouble spots. The frenzy of new data cen... » read more

Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges
By Ann Mutschler - 12 Feb, 2026 - Comments: 1

Key Takeaways • Chiplets and 3D-IC architectures add new thermal-mechanical stresses that can affect the reliability of entire systems. • As chiplets are assembled into packages, defectivity targets become more stringent for each component in a system. • Traditional silos are breaking down, forcing design teams to address issues such as materials choices that previously were handled by... » read more

UCIe’s Major Technical Components Are Now In Place
By Bryon Moyer - 12 Feb, 2026 - Comments: 0

Key Takeaways UCIe 3.0 doubles bandwidth and enhances manageability, addressing new use cases and following an annual update cycle since 2023. The growing demand for chiplet-based architectures in AI data centers is driven by the limitations of monolithic chips, making inter-chiplet communication and connectivity crucial. While UCIe was initially seen as feature-heavy, many of its ma... » read more

Minimum Energy Per Query
By Brian Bailey - 12 Feb, 2026 - Comments: 1

Key Takeaways Extracting heat from a chip faster is a short-term fix to a bigger problem. The longer-term challenge is how to reduce the amount of energy used per query. Data movement, guardbanding, and software inefficiency are key targets for the future. Heat is a serious problem within AI chips, and it is limiting how much processing can be done. The solution is either to... » read more

Catching Critical Defects In TSVs And Stacked Chips
By Laura Peters - 10 Feb, 2026 - Comments: 0

Key Takeaways Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate and distinguishing between yield-killing and false positives. New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stac... » read more

Resistance In Advanced Packages Is Now A System-Level Problem
By Gregory Haley - 10 Feb, 2026 - Comments: 0

Key Takeaways Kelvin measurement, which has been in use for decades, is no longer sufficient for addressing resistance in complex chips. The problem is that resistance is no longer concentrated in transistors, and where it does show up isn't always consistent or obvious. Traditional pass/fail approaches need to be replaced by more granular and flexible analytics and methodologies. ... » read more

Chiplets Add More Inspection And Test Steps
By Anne Meixner - 10 Feb, 2026 - Comments: 0

Key Takeaways Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is forcing changes in how chips are tested and ... » read more

Securing Hardware For The Quantum Era
By Ann Mutschler - 05 Feb, 2026 - Comments: 0

Key Takeaways: Quantum threats to security are already real. Adversaries are already harvesting data that will be decrypted later by quantum computers. Quantum computers capable of breaking RSA and ECC may arrive as early as next year. Asymmetric encryption algorithms like RSA and ECC will become inadequate against quantum threats, while symmetric encryption (such as AES) is less vul... » read more

Consumer And Med Tech Mushroom As Quantum Closes In
By Liz Allan - 05 Feb, 2026 - Comments: 0

Key Takeaways: Universities and companies are making devices inspired by biology and the human senses to help with health monitoring, semiconductor materials development, human-computer interfaces, and more. When this nascent technology becomes a viable product, government regulations will be needed to ensure consumer safety in tracking or treating their body and the environment. Qua... » read more

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems
By Liz Allan - 05 Feb, 2026 - Comments: 0

Key Takeaways: Flexible ICs are durable and form-fitting, but they add manufacturing challenges to already complex processes, while printed flex sensors lack infrastructure. MEMS are finding new popularity in massively parallel systems, on one device, or in many devices distributed across a network. Metal oxide-based sensors are more scalable than those relying on photonic crystals, ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy