category: Top Stories

category: IoT, Security & Automotive

Safety, Security, And Reliability Of AI In Autos
By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

Process Innovations Enabling Next-Gen SoCs and Memories
By Laura Peters - 20 Feb, 2023 - Comments: 0

Achieving improvements in performance in advanced SoCs and packages — those used in mobile applications, data centers, and AI — will require complex and potentially costly changes in architectures, materials, and core manufacturing processes. Among the options under consideration are new compute architectures, different materials, including thinner barrier layers and those with higher th... » read more

Managing Thermal-Induced Stress In Chips
By Karen Heyman - 16 Feb, 2023 - Comments: 0

At advanced nodes and in the most advanced packages, physics is no one's friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase mechanical stress. On the flip side, thinner dielectrics and tighter spaces make it more difficult to insulate and protect against that heat, and in conjunction with those smaller features and higher d... » read more

Devices And Transistors For The Next 75 Years
By Laura Peters - 16 Feb, 2023 - Comments: 0

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at IEDM, spurring debate about the future of CMOS, the role of III-V and 2D materials in future transistors, and what will be the next great memory architecture.[1] Industry veterans from the memory, logic, and research communities see high-NA EUV production, NAND flash with 1,000 layers, and hybrid bon... » read more

2D Semiconductor Materials Creep Toward Manufacturing
By Katherine Derbyshire - 16 Feb, 2023 - Comments: 0

As transistors scale down, they need thinner channels to achieve adequate channel control. In silicon, though, surface roughness scattering degrades mobility, limiting the ultimate channel thickness to about 3nm. Two-dimensional transition metal dichalcogenides (TMDs), such as MoS2 and WSe2, are attractive in part because they avoid this limitation. With no out-of-plane dangling bonds and at... » read more

AI’s Impact In Automobiles Remains Uncertain
By Ed Sperling - 15 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about software updates in cars, where AI makes sense, and why there's a growing sense of optimism, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at Desi... » read more

Simplifying Integration And Security In Home Networks
By Marie C. Baca - 13 Feb, 2023 - Comments: 0

An explosion of devices connected to the internet is driving vendors to implement standards that simplify the initial setup and improve security and integration with other devices, regardless of brand, network protocols, or country of origin. Farthest along in this multi-ecosystem merge is the Connectivity Standards Alliance (CSA), which today is supported by more than 500 companies, includi... » read more

Is RISC-V Ready For Supercomputing?
By Brian Bailey - 09 Feb, 2023 - Comments: 0

RISC-V processors, which until several years ago were considered auxiliary processors for specific functions, appear to be garnering support for an entirely different type of role — high-performance computing. This is still at the discussion stage. Questions remain about the software ecosystem, or whether the chips, boards, and systems are reliable enough. And there are both business and t... » read more

Disaggregating And Extending Operating Systems
By Karen Heyman - 09 Feb, 2023 - Comments: 0

The push toward disaggregation and customization in hardware is starting to be mirrored on the software side, where operating systems are becoming smaller and more targeted, supplemented with additional software that can be optimized for different functions. There are two main causes for this shift. The first is rising demand for highly optimized and increasingly heterogeneous designs, which... » read more

Chiplets Taking Root As Silicon-Proven Hard IP
By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

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