category: Top Stories

category: IoT, Security & Automotive

The Drive Toward Virtual Prototypes
By Brian Bailey - 22 Nov, 2022 - Comments: 1

Chipmakers are piling an increasing set of demands on virtual prototypes that go well beyond its original scope, forcing EDA companies to significantly rethink models, abstractions, interfaces, view orthogonality, and flows. The virtual prototype has been around for at least 20 years, but its role has been limited. It has largely been used as an integration and analysis platform for models t... » read more

Challenges In Backside Power Delivery
By Laura Peters - 17 Nov, 2022 - Comments: 0

One of the key technologies to enable scaling below 3nm involves delivering of power on the backside of a chip. This novel approach enhances signal integrity and reduces routing congestion, but it also creates some new challenges for which today there are no simple solutions. Backside power delivery (BPD) eliminates the need to share interconnect resources between signal and power lines on t... » read more

Hot Trends In Semiconductor Thermal Management
By Karen Heyman - 17 Nov, 2022 - Comments: 1

Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability, as overheated DRAM has to continually r... » read more

Where All The Semiconductor Investments Are Going
By Ed Sperling - 17 Nov, 2022 - Comments: 2

Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

On-Chip Power Distribution Modeling Becomes Essential Below 7nm
By Ann Mutschler - 16 Nov, 2022 - Comments: 0

Modeling power distribution in SoCs is becoming increasingly important at each new node and in 3D-ICs, where tolerances involving power are much tighter and any mistake can cause functional failures. At mature nodes, where there is more metal, power problems continue to be rare. But at advanced nodes, where chips are running at higher frequencies and still consuming the same or greater power... » read more

Improving Reliability In Automobiles
By John Koon - 14 Nov, 2022 - Comments: 0

Carmakers are turning to predictive and preventive maintenance to improve the safety and reliability of increasingly electrified vehicles, setting the stage for more internal and external sensors, and more intelligence to interpret and react to the data generated by those sensors. The number of chips inside of vehicles has been steadily rising, regardless of whether they are powered by elect... » read more

Taking Power Much More Seriously
By Brian Bailey - 10 Nov, 2022 - Comments: 0

An increasing number of electronic systems are becoming limited by thermal issues, and the only way to solve them is by elevating energy consumption to a primary design concern rather than a last-minute optimization technique. The optimization of any system involves a complex balance of static and dynamic techniques. The goal is to achieve maximum functionality and performance in the smalles... » read more

Solving Thermal Coupling Issues In Complex Chips
By Ann Mutschler - 10 Nov, 2022 - Comments: 0

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and systems. Thermal coupling is essentially a junction between two devices, such as a chip and a package, or a transistor and a substrate, in which heat is transferred from one to the other. If not... » read more

Balancing Power And Heat In Advanced Chip Designs
By Karen Heyman - 10 Nov, 2022 - Comments: 1

Power and heat use to be someone else's problem. That's no longer the case, and the issues are spreading as more designs migrate to more advanced process nodes and different types of advanced packaging. There are a number of reasons for this shift. To begin with, there are shrinking wire diameters, thinner dielectrics, and thinner substrates. The scaling of wires requires more energy to driv... » read more

Weird Incidents Reveal L5 Challenges
By Marie C. Baca - 09 Nov, 2022 - Comments: 0

A series of surprising, counterintuitive, and sometimes bizarre incidents reveal the challenges of achieving full Level 5 autonomy in self-driving vehicles, which are an increasingly common site in major cities. While it’s easy to dismiss such anecdotes as humorous glitches compared with the sobering accounts of autonomous tech-related injuries and fatalities, industry executives say these oc... » read more

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