IC Reliability Burden Shifts Left


Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

Why Hardware-Dependent Software Is So Critical


Hardware and software are two sides of the same coin, but they often live in different worlds. In the past, hardware and software rarely were designed together, and many companies and products failed because the total solution was unable to deliver. The big question is whether the industry has learned anything since then. At the very least, there is widespread recognition that hardware-depen... » read more

EDA Embraces Big Data Amid Talent Crunch


The semiconductor industry’s labor crunch finally has convinced chip designers to bet big money on big data. As recently as 2016, executives weren’t sure there was a market for big data approaches to electronic design automation. The following year, utilization of big data remained stuck in its infancy. And in 2018, Semiconductor Engineering questioned why the EDA sector wasn’t investi... » read more

What Quantum Batteries Have in Store


Quantum battery technology is approaching an inflection point similar to the one quantum computing crossed a decade or so ago, escalating it from a theoretical curiosity to an engineering challenge worth solving. Quantum batteries exploit the strange physical laws of the very small — the quantum world — to gain performance advantages over classical batteries. Recent research on charging ... » read more

Power Domain Implementation Challenges Escalate


The number power domains is rising as chip architects build finer-grained control into chips and systems, adding significantly to the complexity of the overall design effort. Different power domains are an essential ingredient in partitioning of different functions. This approach allows different chips in a package, and different blocks in an SoC, to continue running with just enough power t... » read more

Ways To Address The Materials Crunch


Stellar growth over the last two years and the seemingly insatiable demand for chips, at least through 2025, is sparking massive investment by chip firms — as much as $500B over the next five years. But without significant boosts in raw materials, parts for tools, and silicon to fuel facilities, such numbers are unlikely to be met. Materials are the Achilles heel to the rapidly expanding c... » read more

Variation Making Trouble In Advanced Packages


Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

High-NA EUV May Be Closer Than It Appears


High-NA EUV is on track to enable scaling down to the Angstrom level, setting the stage for chips with even higher transistor counts and a whole new wave of tools, materials, and system architectures. At the recent SPIE Advanced Lithography conference, Mark Phillips, director of lithography hardware and solutions at Intel, reiterated the company’s intention to deploy the technology in high... » read more

Chips Can Boost Malware Immunity


Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs


A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

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