category: Applied Innovation

category: IoT, Security & Automotive

What’s In A Node?
By Sundeep Bajikar - 30 May, 2018 - Comments: 0

In an environment where process nodes are no longer consistently delivering the level of improvements predicted by Moore’s Law, the industry will continue to develop “inter-nodes” as a way to deliver incremental improvements in lieu of “full-nodes.” A shift in market requirements, in part due to the rise of AI and IoT, is increasing emphasis on trailing-nodes. When it comes to leading... » read more

Toward A 5G, AI-Centric World
By Sundeep Bajikar - 19 Apr, 2018 - Comments: 0

The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

Mixing 4G And 5G
By Mike Rosa - 15 Mar, 2018 - Comments: 0

5G networks will impact the number and types of ICs in end-user devices and the base stations used to transmit the signals (including the repeaters that rebroadcast those signals). And this is before we begin to consider the technology impact to the infrastructure required to support the data generated in a 5G ecosystem (servers, memory and so on). First, 5G is expected to transmit up to 10 ... » read more

What’s On Display
By Max McDaniel - 15 Feb, 2018 - Comments: 0

Displays provide the window between consumers and the information universe. There is no place like CES, held recently in Las Vegas, to see the most exciting new and future displays. Beyond traditional technologies like television, displays also featured prominently in many of the big trends at the show: AI (Artificial Intelligence), automotive, virtual reality, IoT (Internet of Things) and conn... » read more

The Future Of AI Is In Materials
By Sundeep Bajikar - 09 Jan, 2018 - Comments: 0

I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

Get Ready For 5G
By Mike Rosa - 18 Dec, 2017 - Comments: 0

The 5G wireless rollout, expected to occur over the next few years, will have a major impact on both the number and types of ICs in end-user devices, and on the base stations and repeaters needed to transmit the higher frequency signals. The 5G standard is expected to deliver 10 Gbps of bandwidth— up to 10X the data rates achievable using the advanced forms of 4G— and sub-5ms latencies. ... » read more

Another Dimension For Virtual Reality
By Kerry Cunningham - 16 Nov, 2017 - Comments: 0

When you put on a virtual reality (VR) headset, you are connecting visually to another place—real or imagined. Most people connect VR with gaming, but increasingly business, industry and government users are finding new applications for the evolving technology. These applications, and many more to come, will help drive the adoption of VR and the devices used to access virtual environments. ... » read more

Improving Optical Overlay And Measurement
By Adam Ge - 19 Oct, 2017 - Comments: 0

By Adam Ge and Shimon Levi Patterning challenges for the semiconductor industry are growing as the number of multi-patterned layers being used in the 10nm and beyond nodes increase. Patterning requires highly accurate overlay which has always been an issue, but with the added complexities of multi-patterning, smaller dimensions and subsequent tightening overlay error budget, it is now a majo... » read more

Toward Smarter Manufacturing
By Ganesh Hegde - 20 Jul, 2017 - Comments: 0

Semiconductor manufacturing is becoming increasingly competitive as significant investments in capital equipment are required to meet consumer demand for higher performing devices with greater functionality. To boost their competitiveness, chip makers are adopting Industry 4.0 manufacturing techniques to achieve higher levels of operational excellence. In this blog, I explain Industry 4.0, prov... » read more

Making Interconnects Faster
By Mehul Naik - 22 May, 2017 - Comments: 3

In integrated circuits, interconnect resistance is a combination of wire and via resistance. Wire resistance of a conductor depends on several factors, one of which is the electron scattering at various surfaces and grain boundaries. Via resistance, on the other hand, is a function of the thickness or resistivity of the layers at the bottom of the via through which current must travel. T... » read more

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