Cellular Stranglehold?


Do you ever feel like you are completely at the mercy of your cellular service provider? Yeah, me too. Not only did I have to change providers when I relocated, I had to buy a new phone of course. Since my old phone and my new phone were both iPhones, I thought for sure I could use the same car charger….but no dice. This fact has bothered me for quite some time because it made no sense to ... » read more

Your Job is Harder Than Mine


What I do for a living is listen – a lot – and try to make sense of the myriad challenges that I hear about in terms of design and managing power and performance. What you do as an architect, design engineer or verification engineer is live in the trenches with it all, every day. I admire and respect that. This is especially true as I recently pondered and talked with industry luminaries... » read more

Modeling the Future


Every once in a while I read through the employment listings as part of the Semiconductor Manufacturing group on LinkedIn because I find it fascinating to see what employers are looking for even if I am not applying. Particularly for verification engineering position, one of the job responsibilities typically includes development of the architecture for a functional verification environment ... » read more

Getting In the Ballpark


I admit it; I still have DAC on the brain. Even though attendance may not have been what the exhibitors would have liked to see, the conference is always a fantastic place to discuss ideas and pick up on trends. One topic I discussed with a number of folks are the challenges associated with design today, from the power-performance balance, 3D stacking to new process nodes and complexity, to nam... » read more

Bubble Gum and Scotch Tape


It’s always extremely interesting to talk with actual design engineers, trudging through the trenches of challenges like 3D design. Recently, I was able to speak with Robert Patti, chief technology officer, vice president of design engineering and a director at Tezzaron Semiconductor. The company has been putting 3D designs together for quite some time so I expected to hear that they are u... » read more

Training The Next Gen For Low Power


Reflecting on my time at this year's Design Automation Conference, I am quickly reminded that I work in the most fascinating industry I can think of. Having the opportunity to discuss deep technical low power design issues, forward-looking challenges as well as the business implications face to face with thought leaders is inspiring and invigorating. With the amount of brain power filling Mosco... » read more

Mixed-Signal Integration Drives Platform Chips


Not only are there low-power challenges with just about every design today, there are also very interesting issues concerning integration of mixed-signal onto chips. As chips are get bigger and more costly to develop, many companies are turning to platform chips that can be used in a smartphone and in a tablet with slightly different twists in the functionality of that platform chip because ... » read more

Fundamentals For 3D IC Flows


While true 3D ICs are a few years off, 2.5D is here. There are some key differences, namely that with 2.5D the interposer is a passive die, but there also are some fundamental shared requirements. Samta Bansal, senior product marketing for Silicon Realization at Cadence asserted that first, the digital, custom and package environments must be seamless. “There has to be a co-design between ... » read more

A Necessary Duo: IP And Assertions


By Ann Steffora Mutschler Assertions are key to complete and accurate verification, as I dove into here, and there are implications for IP as well. In the case of an embedded processor core that is shipped out as an RTL by the IP vendor, and then used by an engineering team to create a cell phone SoC or to create a consumer SoC for a set-top box or what have you, that core goes into an end ... » read more

The Low Power-System Level Connection


I don’t know about you but I am fired up (in a good way) with everything surrounding low power and design at the system level. We are at a point where the challenges are pretty well understood, we can see the way forward in many areas, but what needs to happen next is the evolution of technology that will compel users to adopt the new techniques, which may have yet to be created. Engineeri... » read more

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