Tech Talk: Automotive Design

By Ann Mutschler - 22 Mar, 2018 - Comments: 0

NetSpeed Systems CEO Sundari Mitra talks about how to speed up the design of automotive chips. https://youtu.be/cus4fStDa5c » read more

Tech Talk: Faster Simulation

By Ann Mutschler - 22 Mar, 2018 - Comments: 0

Cadence’s Adam Sherer talks about how to speed up simulation in complex multi-core designs. https://youtu.be/lDgMwU5KN7U » read more

Tech Talk: 5/3nm Parasitics

By Ed Sperling - 22 Feb, 2018 - Comments: 0

Ralph Iverson, principal R&D engineer at Synopsys, talks about parasitic extraction at 5/3nm and what to expect with new materials and gate structures such as gate-all-around FETs and vertical nanowire FETs. https://youtu.be/24C6byQBkuI » read more

Tech Talk: Verification

By Ed Sperling - 30 Nov, 2017 - Comments: 0

Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

Tech Talk: Pseudo SRAM

By Ed Sperling - 26 Oct, 2017 - Comments: 0

eSilicon's Kar Yee Tang explains how to improve performance at 10/7nm without affecting power and area. https://youtu.be/4LI1pBLxxS4 » read more

Tech Talk: TCAM

By Ed Sperling - 28 Sep, 2017 - Comments: 0

Dennis Dudeck, IP solutions FAE at eSilicon, talks about how to save power and area with ternary content addressable memory. https://youtu.be/y1FhdoNdzOw » read more

Tech Talk: DO-254

By Ed Sperling - 24 Aug, 2017 - Comments: 0

Aldec's Louie De Luna explains the safety critical standard for the aerospace industry and how that parallels what's happening in automotive electronics. https://youtu.be/qa1g1NNVj60 » read more

Tech Talk: ISO 26262

By Ed Sperling - 12 Jun, 2017 - Comments: 0

Arteris' Kurt Shuler discusses what's changing in the automotive standard and how everything is supposed to work in the future. » read more

Biz Talk: ASICs

By Ed Sperling - 27 Mar, 2017 - Comments: 0

eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk] Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Tech Talk: Timing Closure

By Ed Sperling - 29 Dec, 2016 - Comments: 0

Arteris' George Janac talks about timing closure issues in advanced chips and why this has reared its head again for the first time in a decade. Related Stories Timing Closure Issues Resurface Adding more features and more power states is making it harder to design chips at 10nm and 7nm. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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