AI Inference Acceleration


Geoff Tate, CEO of Flex Logix, talks about considerations in choosing an AI inference accelerator, how that fits in with other processing elements on a chip, what tradeoffs are involved with reducing latency, and what considerations are the most important. » read more

Memory Access In AI Systems


Memory access is a key consideration in AI system design. Ron Lowman, strategic marketing manager for IP at Synopsys, talks about how memory affects overall power consumption, why partitioning of on-chip and off-chip is so critical to performance and power, and how this changes from the cloud to the edge. » read more

eFPGAs Vs. FPGA Chiplets


Embedded FPGAs are a totally different concept from discrete FPGA chiplets, and that is reflected in size, cost, power and performance. Geoff Tate, CEO of Flex Logix, talks about which applications are best for each, how each maximizes power and performance, and why choices will vary greatly by application. Related eFPGA Knowledge Center FPGA Knowledge Center Increasing EFPGA Densit... » read more

Ins And Outs Of In-Circuit Monitoring


At 7nm and 5nm, in-circuit monitoring is becoming essential. Steve Crosher, CEO of Moortec, talks about the impact of rising complexity, how different use cases and implementations can affect reliability and uptime, and why measuring electrical, voltage and thermal stress can be used to statistically predict failures and improve reliability throughout a chip’s lifetime. » read more

3 Types Of AI Hardware


As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

Increasing eFPGA Density


How to boost embedded FPGA density to the point where it is competitive with traditional FPGAs, at a lower cost and faster turnaround time. Geoff Tate, CEO of Flex Logix, talks about the importance of interconnects and standard cells in adding flexibility into chips, and why eFPGAs are suddenly gaining attention. » read more

Using ML In Manufacturing


How to prevent early life failures by applying machine learning to different use cases, and how to interpret models for different tradeoffs on reliability. Jeff David, vice president of AI solutions at PDF Solutions, digs down into how to utilize data to improve reliability. » read more

Different Levels Of Interconnects


The interconnect hierarchy from metal 0 in a semiconductor all the way up to racks of servers. Kurt Shuler, vice president of marketing at Arteris IP, explains why each one is different, and how every level can contribute to latency and performance. » read more

DAC 2020: Virtual And Different


Zhuo Li, group director at Cadence, and Harry Foster, chief scientist at Mentor, a Siemens Business, talk about the changes in content for this year's Design Automation Conference. » read more

High-Speed SerDes At 7/5nm


Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA implications of moving large amounts of data across and around a chip. » read more

← Older posts Newer posts →