category: Videos

category: IoT, Security & Automotive

Using ML In Manufacturing
By Ed Sperling - 23 Jun, 2020 - Comments: 0

How to prevent early life failures by applying machine learning to different use cases, and how to interpret models for different tradeoffs on reliability. Jeff David, vice president of AI solutions at PDF Solutions, digs down into how to utilize data to improve reliability. » read more

Different Levels Of Interconnects
By Ed Sperling - 17 Jun, 2020 - Comments: 0

The interconnect hierarchy from metal 0 in a semiconductor all the way up to racks of servers. Kurt Shuler, vice president of marketing at Arteris IP, explains why each one is different, and how every level can contribute to latency and performance. » read more

DAC 2020: Virtual And Different
By Ed Sperling - 08 Jun, 2020 - Comments: 0

Zhuo Li, group director at Cadence, and Harry Foster, chief scientist at Mentor, a Siemens Business, talk about the changes in content for this year's Design Automation Conference. » read more

High-Speed SerDes At 7/5nm
By Ed Sperling - 02 Jun, 2020 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA implications of moving large amounts of data across and around a chip. » read more

Ensuring HBM Reliability
By Ed Sperling - 27 May, 2020 - Comments: 0

Igor Elkanovich, CTO of GUC, and Evelyn Landman, CTO of proteanTecs, talk with Semiconductor Engineering about difficulties that crop up in advanced packaging, what’s redundant and what is not when using high-bandwidth memory, and how continuous in-circuit monitoring can identify potential problems before they happen. » read more

Cleaning Data For Final Test
By Ed Sperling - 20 May, 2020 - Comments: 0

John O’Donnell, CEO of yieldHUB, talks about why data integrity is so critical for final test, what can cause it to be less-than-perfect, what’s needed to improve the quality of that data, and how that impacts the overall yield in a fab. » read more

Rising Packaging Complexity
By Ed Sperling - 19 May, 2020 - Comments: 1

Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow. » read more

Big Changes For eFPGAs
By Ed Sperling - 11 May, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks with Semiconductor Engineering about the state of embedded FPGAs, why this is easier for some companies than others, why this is important for adding flexibility into an ASIC, and what are the main applications for this technology. » read more

Who Owns A Car’s Chip Architecture
By Ed Sperling - 05 May, 2020 - Comments: 0

Kurt Shuler, vice president of marketing at Arteris IP, examines the competitive battle brewing between OEMs and Tier 1s over who owns the architecture of the electronic systems and the underlying chip hardware. This has become a growing point of contention as both struggle for differentiation in a market where increasingly autonomous vehicles will all behave the same way. That, in turn, has si... » read more

Using Big Data For Yield And Reliability
By Ed Sperling - 22 Apr, 2020 - Comments: 0

John O’Donnell, CEO of yieldHUB, talks about the importance of clean data for traceability, yield improvement and device reliability, where and how it gets cleaned, and why that needs to be accompanied by domain expertise. » read more

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