Balancing better performance through hardware-software co-design with flexibility in design.
Cheng Wang, senior vice president of engineering at Flex Logix, talks about inferencing at the edge, what are some of the main considerations in designing and choosing an inferencing chip, why programmability and modularity are important, and how hardware-software co-design with algorithms can improve performance and power.
Steps are being taken to minimize problems, but they will take years to implement.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
Number of options is growing, but so is the list of tradeoffs.
But that doesn’t mean it’s going to be mainstream anytime soon.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Steps are being taken to minimize problems, but they will take years to implement.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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