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Scaling Bump Pitches In Advanced Packaging


Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Leveraging Symbolic Simulations For IO Verification


IO libraries and interface IPs are an important part of any integrated circuit design that needs to communicate with the outside world or other integrated circuits. Interface IPs are the literal gatekeepers to the flow of logical and electrical information from one IC to another to form today’s complex computer systems, influencing almost every aspect of our lives these days. Interface IPs (e... » read more

Primary, Anonymous, or What?


Top level primary I/Os remain mysterious in the verification world, specifically when you consider UPF-based low power designs. In real silicon, they are usually driven by off-chip supplies; however, verification complications are multifold for RTL and gate level simulations of them. This paper studies the “simulation-impacting” features of design top IOs and the effect of each feature on v... » read more

Meeting Automotive Functional Safety Requirements With GPIOs


Automotive OEMs are building advanced driver assistance systems (ADAS) to improve safety. ADAS systems must meet stringent performance, power, and cost requirements, so the system-on-chips (SoCs) that make up ADAS and passenger safety systems integrate advanced protocols and are built on leading edge finFET process technologies. Designers of this new class of ADAS SoCs are challenged to meet IS... » read more

Steep Spike For Chip Complexity And Unknowns


Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Chips Good Enough To Bet Your Life On


Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Faster Inferencing At The Edge


Cheng Wang, senior vice president of engineering at Flex Logix, talks about inferencing at the edge, what are some of the main considerations in designing and choosing an inferencing chip, why programmability and modularity are important, and how hardware-software co-design with algorithms can improve performance and power. » read more

Power Becomes Bigger Concern For Embedded Processors


Power is emerging as the dominant concern for embedded processors even in applications where performance is billed as the top design criteria. This is happening regardless of the end application or the process node. In some high-performance applications, power density and thermal dissipation can limit how fast a processor can run. This is compounded by concerns about cyber and physical secur... » read more

HBM Issues In AI Systems


All systems face limitations, and as one limitation is removed, another is revealed that had remained hidden. It is highly likely that this game of Whac-A-Mole will play out in AI systems that employ high-bandwidth memory (HBM). Most systems are limited by memory bandwidth. Compute systems in general have maintained an increase in memory interface performance that barely matches the gains in... » read more

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