category: Videos

category: IoT, Security & Automotive

Cost And Quality Of Chiplets
By Ed Sperling - 19 Mar, 2024 - Comments: 0

Chiplets add a whole new challenge for the semiconductor industry. How much testing is enough? How do you optimize system binning? What’s the right amount of burn-in? The answers to these questions will vary, depending upon cost and quality tradeoffs, the number and source of the chiplets, and real-world workloads and projected lifespans. Marc Jacobs, senior director of solutions architectur... » read more

Changes And Challenges In Auto MCUs
By Ed Sperling - 13 Mar, 2024 - Comments: 0

Microcontrollers have been a key component in automotive for years, starting with single-core devices with limited on-chip memory for very basic functions, and evolving toward multi-core systems with more memory for more complex tasks. But as vehicles become increasingly automated, microcontrollers are changing significantly, and so is the perception of how to utilize them. These new devices ne... » read more

Integration Challenges For RISC-V Designs
By Ed Sperling - 27 Feb, 2024 - Comments: 0

One of the big draws of RISC-V is that it allows design teams to create unique chips or chiplets and to make modifications to the instruction-set architecture. That extra degree of freedom also creates some issues when it comes to integrating those designs into packages or systems because they may require non-standard connectivity approaches. Frank Schirrmeister, vice president of marketing at ... » read more

New Issues In Power Semiconductors
By Ed Sperling - 26 Feb, 2024 - Comments: 0

The number of challenges is growing in power semiconductors, just as it is in traditional chips. Thermal dissipation and gradients, new design rules, and layout issues need to be considered, especially in the context of higher voltage and increased performance demands. Roland Jancke, design methodology head in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about issues in int... » read more

Yield Tracking In RDL
By Ed Sperling - 07 Feb, 2024 - Comments: 0

Yield is a much bigger issue when it comes to panel-level packages, which may contain up to 24 RDL layers. Just finding the defects is a massive challenge, let alone understanding how they will impact the entire device. Many of these advanced packages are being used in data centers for generative AI, and killer defects caused by bridges and opens can cause serious problems. What happens, for in... » read more

How To Stop Row Hammer Attacks
By Ed Sperling - 30 Jan, 2024 - Comments: 0

Row hammer is a well-publicized target for cyberattacks on DRAM, and there have been attempts to stop these attacks in DDR4 and DDR5, but with mixed results. The problem is that as density increases, distance decreases, making it more likely that flipped bit cell in one row can disturb a bit cell in another, and that bits flipped across an entire row can flip another row. Steven Woo, fellow and... » read more

What’s Changing In DRAM
By Ed Sperling - 22 Jan, 2024 - Comments: 0

More data requires more processing and more storage, because that data needs to be stored somewhere. What’s changing is that it’s no longer just about SRAM and DRAM. Today, multiple types of DRAM are used in the same devices, each with its own set of tradeoffs. C.S. Lin, marketing executive at Winbond, talks about the potential problems that causes, including mismatches in latency, and high... » read more

Reducing Power In Data Centers
By Ed Sperling - 16 Jan, 2024 - Comments: 0

The rollout of generative AI, coupled with more data in general, is requiring data centers to run servers harder and longer. That, in turn, is generating more heat and accelerating aging, and to ensure these systems continue working over their projected lifetimes, chipmakers are building extra margin into chips. That increases the amount of energy required to run and cool them, and it can short... » read more

Using Deep Data For Improved Reliability Testing
By Ed Sperling - 08 Jan, 2024 - Comments: 0

Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Mor... » read more

Densification Of RF Designs
By Ann Mutschler - 20 Dec, 2023 - Comments: 0

It’s challenging enough to deal with wireless signals at the 5G and 6G frequencies. But with increased density in chips crammed into smaller packages, higher power, beam forming, and MIMO, design requirements are very different than in the past. Simple parasitic extraction no longer is sufficient. Daren McClearnon, product manager for RF and microwave simulation at Keysight, talks about the n... » read more

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