Inside Chips Podcast: Data Movement In The AI Age


AI is all about data movement — lots of it. The key is to move data as little as possible, and when it is moved, to do it efficiently, securely, and blindingly fast. Semiconductor Engineering talks with Arteris CEO Charlie Janac in this one-on-one discussion about the impact of AI on networks on chip and what will change going forward. To listen to the podcast, click here. » read more

The Evolution of DRAM


DRAM has been around since 1966, but today it's still the same basic 1T 1C bit cell architecture. Yet changes are coming as DRAM is called upon to store and retrieve more data faster. Steve Woo, distinguished inventor and fellow at Rambus, talks about how DRAM works, why there are different flavors, the impact of cooling new solutions in denser configurations, and ongoing issues involving the s... » read more

Using AI For Fault Detection And Classification In Manufacturing


Third in a seven-part series: Classic fault detection and classification has some classic problems. It's reactive, time-consuming to set up, and any product change involves significant man-hours. Even then, it still misses a lot of problems, which result in scrap. This is where machine learning can excel, because it can sift through huge amounts of data from thousands of sensors and find outlie... » read more

Challenges In Stacking HBM


AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

Preparing For The Quantum Computing Age


Within a decade, quantum computers will be able to break virtually any encryption algorithm in use today. What used to be science fiction is on its way to becoming a commercial reality. Once that happens, quantum computers will be able to crack in minutes what was supposed to be unbreakable for more than a century using the most powerful computers available. Erik Wood, senior director of crypto... » read more

Advanced Part Average Testing For Chips


Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies. In the past, PAT produced a Gaussian distribution that made it relatively simple to find outliers. That's no longer the case. Advanced packaging and leading-edge designs have unique attributes that determine which rules apply, such as the thickness o... » read more

Machine Learning In Semiconductor Manufacturing


Second in a seven-part series: Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but it remains relevant even today. It can be applied to semiconductor fab for such things as predictive maintenance of manufacturing equipment, rather than just maintenance on a schedule, which decreases downtime. But getting this right is har... » read more

AI, From A To Z


First in a seven-part series: What's the difference between AI, ML, DL, LLMs, and agentic AI? Is it truly revolutionary, or is it an evolutionary series of steps that have enabled machines to do much more than in the past? Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about the evolution of AI over nearly 70 years, the chain of innovation that has enable... » read more

Workload-Specific Hardware Accelerators


Workload-specific hardware accelerators are becoming essential in large data centers for two reasons. One is that general-purpose processing elements cannot keep up with the workload demands or latency requirements. The second is that they need to be extremely efficient due to limited electricity from the grid and the high cost of cooling these devices. Sharad Chole, chief scientist and co-foun... » read more

What’s Different About HBM4


Memory bandwidth is limiting the flow of huge datasets that are needed to train AI models. There is much more data to process, store, and retrieve, but the speed at which that data moves through high-bandwidth memory (HBM) stacks is significantly lower than the speed at which data can be processed. Frank Ferro, group director for product management at Cadence, talks about the new HBM4 standard,... » read more

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